DISCO Corporation: Advancing Precision Processing Technologies for Semiconductor Manufacturing with Excellence and Innovation.
Locations
DISCO Corporation
2-13-11 Omorikita, Ota-Ku
Tokyo, 143-8580, Japan
Phone: +81-3-4590-1111
Headquarters
DISCO Corporation
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DISCO Corporation

DISCO Corporation is a leading provider of precision processing equipment and solutions, known for its 'Kiru', 'Kezuru', and 'Migaku' technologies. With a corporate history dating back to 1937, DISCO has established itself as a reliable and innovative company in the industry.

The company's core technologies focus on dicing, grinding, and polishing, enabling advanced and efficient semiconductor manufacturing processes. DISCO Values, established in 1997, guide their business activities, emphasizing social responsibility and value exchange with stakeholders.

DISCO offers a comprehensive range of precision machines, including dicing saws, laser saws, grinders, and more. Their precision processing tools, such as dicing blades and grinding wheels, ensure exceptional quality and performance.

With a customer-centric approach, DISCO provides extensive support services, including training, applications support, and after-sales assistance. The company's commitment to excellence and enjoyment in work fosters a fulfilling work environment for its dedicated professionals.

Committed to advancement, DISCO invests in R&D, exemplified by its Earthquake-Resistance Verification and newly developed processes for GaN wafers and sapphire processing.

DISCO Corporation remains dedicated to its mission of bringing science and technology closer to everyday living while valuing sustainability and CSR initiatives.