MH110XC-KK-FA Camera Based On CCD Sensor OnSemi KAI-11002
Description
High resolution direct phosphor imaging, ideal for researching the elemental composition and structure of biological samples through Micro CT (Computed Tomography), Soft X-Ray Microscopy, X-Ray Spectroscopy, Coherent X-Ray Diffraction, Crystallography, Non-Destructive Testing, Fluoroscopy, Plasma Diagnostics, Radiography, Industrial CT scanning and more.
MH110XC-KK-FA Camera Based On CCD Sensor OnSemi KAI-11002
Specifications |
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|---|---|
| Sensor Type: | CCD |
| Detection Method: | Direct Detection |
| # Pixels (Width): | 4008 |
| # Pixels (Height): | 2672 |
| Pixel Size (Square): | 9 um |
| Bit Depth: | 14 bit |
| Full Frame Rate: | 2 fps |
| X-Ray Energy Range: | 7000-100000eV |
Features
11 Mpix KAI-11002 sensor Grade 1
Peltier TE Cooled with Heatsink and optional fan
No microlenses, Taped glass
Magnification: 1:1
Fiber center to center distance: 6 μm, Thickness: 5 mm
Radiation hardened
Enhanced Statistical Extra-Mural Absorption
Non-linearity over full dynamic range <2% (of full scale) to 95% of full scale
Antiblooming, LVTTL trigger
Scintillator phosphor composition P43, Gd2O2S:Tb, Thickness 22 μm
Support of Energy levels 7 to 100keV
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
Germany
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Sold by:
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On FindLight:
since 2019
Frequently Asked Questions
The MH110XC-KK-FA camera is used for researching the elemental composition and structure of biological samples through Micro CT (Computed Tomography), Soft X-Ray Microscopy, X-Ray Spectroscopy, Coherent X-Ray Diffraction, Crystallography, Non-Destructive Testing, Fluoroscopy, Plasma Diagnostics, Radiography, Industrial CT scanning and more.
The camera features an 11 Mpix KAI-11002 sensor.
The fiber center to center distance is 6 μm.
The thickness of the scintillator phosphor composition is 22 μm.
Yes, the camera is customizable. The option set includes other sensors, interfaces, scintillators, and housing designs.