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Laser Depaneling Machines
Frequently Asked Questions
One of the most cutting-edge methods for separating printed circuit boards (PCBs) from the entire panel of arrays is referred to as laser depaneling. Printed circuit boards (PCBs) that have already been manufactured in arrays on large panels require a careful separation before they can be used as individual electronic components. Laser depaneling machines are specially designed laser cutters with CNC capabilities that allow an automated cutting (detachment) of PCBs from larger panels
As you consider adopting laser depaneling machines for your PCB fabrication process you should take into account the total cost of ownership to calculate the proper unit economics. Laser depaneling is a clean, environmentally friendly process that can save on consumables. It also will save you on scrap costs thanks to a high degree of accuracy and repeatability. In a long run the cost of ownership can be justified depending on volume production and the machinery used. Because of the great variance in the range of parameters and features the price on individual machines can vary significantly. Please do not hesitate to inquire pricing on any model of interest.
Laser depaneling offers high-precision cuts, free of dust and carbonization. Thanks to its minimally invasive approach it can depanel PCBs with no mechanical stress or damage due to non-contact and vibration-free separation. Its high accuracy and repeatability allows fabricating with minimal scrap and material usage.
There are several parameters and options to look for when choosing the right laser depaneling system for your applications. Work and scan fields are two important parameters that along with max cutting speed will determine you production capacity. Laser output, including the source (fiber, CO2, DPSS, etc.), the output power and the wavelength will determine the list of materials that they can operate on. Before selecting a machine, please ensure that it is designed to cut through the material you intend to cut.
Laser depaneling offers unique features that are advantages over mechanical methods of cutting. This includes the high production speed leading to increased output, lower cost of ownership in the long term, less material usage (thanks to scrap savings and the absence of consumable), high precision and accuracy.
Laser depaneling machines can operate on most common PCB board materials including on FFR4, FPCB, Ceramics, SIP, PTFE, Metal, Rigid PCB, Double-Sided PCB, etc. If in doubt, please do not hesitate to inquire; suppliers on FindLight will be eager to respond to your questions.
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