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Laser Depaneling Machines

The WXR-220UD is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing. This dual-platform machine offers exceptional precision, speed, and compatibility, making it an ideal solution for cutting and depaneling flexible and rigid circuit boards. With an integrated laser cutting ...

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 500 mm
Work Area / Panel Thickness (Max): 2 mm
Scan Field: Other (see specs)
Scan Speed: 300 mm/sec
FPC Laser Depaneling Machine
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical ...

Specifications

Work Area / Panel Length: 600 mm
Work Area / Panel Width: 450 mm
Work Area / Panel Thickness (Max): 1.2 mm
Scan Field: Not specified
Scan Speed: -- mm/sec
De-Panel PCB Laser Depaneling Machine
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
This is a PCB Laser Depaneling Machine. It offers intelligent automation. Using built-in high-precision CCD camera you can easily locate and focus.Positioning is fast and accurate, without manual intervention. It offers simple operation, with a one-button mode which greatly improves production efficiency. With an automatic ...

Specifications

Work Area / Panel Length: 600 mm
Work Area / Panel Width: 450 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
EVO DEPANEL
EMEA Electro Solutions
ACCURATE AND DUST FREE ROUTING SYSTEM FOR PCBA DEPANELING APPLICATION.

Specifications

Work Area / Panel Length: 310 mm
Work Area / Panel Width: 410 mm
Work Area / Panel Thickness (Max): 2 mm
Scan Field: Not specified
Scan Speed: -- mm/sec
UV Laser Depaneling Machine For PCB - FPC - Printed Circuit Board YSV-6A
YUSH Electronic Technology Co.,Ltd
This systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers. 

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): 11 mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Two Axis Table Laser PCB Depaneling Machine
Winsmart Electronic Co.,Ltd
This PCB Laser Depaneling equipment is integrated with high-stability and the best performance UV laser generator. The equipment delivers great working area focus, power distribution ratio and small thermal affection that gives small cutting width and high cutting quality during processing. With a sophisticated two-axis table ...

Specifications

Work Area / Panel Length: 460 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
Genitec We are PCB separator expert. We provide PCB depaneling total solution. Genitec founded in Taiwan in 1993. We have two factories for over 20000 square meters. We produce most kind of PCB separator. Including PCB router, laser PCB separator, V-cut, PCB/FPC punching machine. If you have any project about PCB depaneling, welcome ...

Specifications

Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
DIVISIO 8000 Machine Platform For Laser Depaneling
SDG S.r.l.
The DIVISIO 8000 Series is a machine platform for laser depaneling of rigid and flex PCBs. A hard stone base allows for maximum stability and precision. Different beam sources are available to adapt the laser cutting process to the substrate material. The system is available as a stand-alone manual loading system or fully ...

Specifications

Work Area / Panel Length: 305 mm
Work Area / Panel Width: 250 mm
Work Area / Panel Thickness (Max): 16 mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
DirectLaser S6 Laser Depaneling Machine
DCT Laser Solutions GmbH
Laser depaneling opens up a whole new world of opportunities regarding precision, reliability, flexibility and cost efficiency of PCBs. Laser routing of populated flexible, flex-rigid and thin rigid PCBs significantly reduces the cost of your PCBs. No cutting dyes are needed for flexible PCBs. On rigid PCB panels the millimeter ...

Specifications

Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
LOW Laser Depaneling machine
Systemtechnik Hölzer GmbH
The highly dynamic LOW laser depaneling machine is especially suitable for medium to high product volumes and meets growing requirements in the production process. Printed circuit boards of various materials are made using low-dust, low-stress laser sawing and milling techniques separated with maximum product flexibility, ...

Specifications

Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
IRLD Inline Rotary Laser Depaneler
GETECH
IRLD is an inline laser depaneling machine specifically designed to depanel and/or singulate rigid and semi-flexible PCBs with high precision and repeatability. It is suitable for handling densely populated printed circuit board assemblies (PCBA) in automatic production assembly lines. The system consists of up to 4 high-speed ...

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): 1.0 mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
UV FPC Laser Cutting Machine PCB Laser Depaneling Services CWVC-6
ChuangWei Electronic Equipment Manufactory
Lasers are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges ...

Specifications

Work Area / Panel Length: 460 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
PCB Laser Depaneling Machines PCB Separator
ChuangWei Electronic Equipment Manufactory
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depaneling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical ...

Specifications

Work Area / Panel Length: 460 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
LPKF CuttingMaster 3000 Ci
LPKF Laser & Electronics AG
Characterized by its high efficiency, performance and quality of cut edges, the CuttingMaster 3000 is a depaneling machine that delivers the best results for almost any cutting task. The CuttingMaster 3000 has several variants that operate with pulse durations in the nanosecond and even picosecond range. The laser power can ...

Specifications

Work Area / Panel Length: 460 mm
Work Area / Panel Width: 305 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
DIVIDOS HIGH SPEED LASER DEPANELING SOLUTION
InnoLas Solutions GmbH
The DIVIDOS series meets all requirements for laser depaneling of rigid and flexible printed circuit boards and separates different materials extremely fast, stress-free and without residues. In the FULL CUT process (cut without webs), up to 300% more panels can be provided on a PCB and separated in this way, depending on the PCB ...

Specifications

Work Area / Panel Length: 457 mm
Work Area / Panel Width: 457 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Control Micro Systems UV Laser Depaneler
Control Micro Systems Inc
CMS Laser has successfully developed two types of laser depaneling systems that included an in-line conveyor and a semi-automatic manual load system. Either design can be integrated with a CO2 or UV laser head depending on application requirements. Both designs include an integrated vision system, are CDRH Class I ...

Specifications

Work Area / Panel Length: 508 mm
Work Area / Panel Width: 457 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Laser Depaneling PCB Machine HDZ- UVC3030
Han's Laser Corporation
Laser depaneling machine for PCB and related industry. A turn-key design. Our UV laser depaneling machine is assembled with a state-of-the-art 355nm Draco laser module, with fine-tuning, which ensures consistent, high-quality cutting on the fiberglass material (FR4) and flexible PCB. The cold working method produces small ...

Specifications

Work Area / Panel Length: 400 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
PCB Laser Depaneling System
Hylax Technology Pte Ltd
With the advent of new and high power plus lower cost UV lasers there is greater adoption of cutting of materials like printed circuit boards. This boards may be produced from fiber glass materials like FR4 or for thin flexible circuits they may be fabricated from polyimide or kapton. This process can now be ...

Specifications

Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
MicroCut 1000 Offline LASER Depaneling
Martintrier Technology
MicroCut 1000 Offline LASER is an automatic laser depaneling system for printed circuit boards. It offers clean and stress-free detachment of individual boards from an array of boards on a large panel. 

Specifications

Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 200 mm/sec
Laser PCB Depaneling Machine
HGLaser Engineering Co,.Ltd.
Laser depaneling uses the focused high power density laser beam to irradiate workpiece. Under the laser power density exceeding a specific threshold, enough heat is absorbed by the panel which causes the panel material to form microscopic pores through a gasification process. As the laser beam passes through a predefined trajectory, ...

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: -- mm/sec

Frequently Asked Questions

One of the most cutting-edge methods for separating printed circuit boards (PCBs) from the entire panel of arrays is referred to as laser depaneling. Printed circuit boards (PCBs) that have already been manufactured in arrays on large panels require a careful separation before they can be used as individual electronic components. Laser depaneling machines are specially designed laser cutters with CNC capabilities that allow an automated cutting (detachment) of PCBs from larger panels

As you consider adopting laser depaneling machines for your PCB fabrication process you should take into account the total cost of ownership to calculate the proper unit economics. Laser depaneling is a clean, environmentally friendly process that can save on consumables. It also will save you on scrap costs thanks to a high degree of accuracy and repeatability. In a long run the cost of ownership can be justified depending on volume production and the machinery used. Because of the great variance in the range of parameters and features the price on individual machines can vary significantly. Please do not hesitate to inquire pricing on any model of interest.

Laser depaneling offers high-precision cuts, free of dust and carbonization. Thanks to its minimally invasive approach it can depanel PCBs with no mechanical stress or damage due to non-contact and vibration-free separation. Its high accuracy and repeatability allows fabricating with minimal scrap and material usage.

There are several parameters and options to look for when choosing the right laser depaneling system for your applications. Work and scan fields are two important parameters that along with max cutting speed will determine you production capacity. Laser output, including the source (fiber, CO2, DPSS, etc.), the output power and the wavelength will determine the list of materials that they can operate on. Before selecting a machine, please ensure that it is designed to cut through the material you intend to cut.

Laser depaneling offers unique features that are advantages over mechanical methods of cutting. This includes the high production speed leading to increased output, lower cost of ownership in the long term, less material usage (thanks to scrap savings and the absence of consumable), high precision and accuracy.

Laser depaneling machines can operate on most common PCB board materials including on FFR4, FPCB, Ceramics, SIP, PTFE, Metal, Rigid PCB, Double-Sided PCB, etc. If in doubt, please do not hesitate to inquire; suppliers on FindLight will be eager to respond to your questions.

There are 26 different Laser Depaneling Machines from suppliers and manufacturers listed in this category. In just a few clicks you can compare different Laser Depaneling Machines with each other and get an accurate quote based on your needs and specifications. Please note that the prices of Laser Depaneling Machines vary significantly for different products based on various factors including technical parameters, features, brand name, etc. Please contact suppliers directly to inquire about the details and accurate pricing information for any product model. Simply navigate to the product page of interest and use the orange button to directly reach out to the respective supplier with one click.

Did You know?

Laser Depaneling Machines (also known as PCB Depaneling Machines) are special laser cutting systems to carefully detach printed circuit boards (PCBs) from the panel they are printed on. In mass manufacturing PCBs are printed on a relatively large panel with batches. To make individual circuit boards those units need to be cut out (“depaneled”) from the array of circuits on the panel. Thanks to advances of laser as well as laser beam delivery technologies PCB laser depaneling has become the current standard in electronic manufacturing industry. The cutting precision offered by current laser sources offers unmatched precision in the slicing process. Availability of sources in a wide spectral range from UV to IR ensures operating capability on nearly any surface. Similarly, laser beam delivery technology offer X-Y-Z scanning capabilities with micron level precision.