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  4. Laser Depaneling Machines
  5. 50 x 50 mm^2

50 x 50 mm^2 Laser Depaneling Machines

DIVISIO 8000 Machine Platform For Laser Depaneling
SDG S.r.l.
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DIVISIO 8000 Machine Platform For Laser Depaneling
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The DIVISIO 8000 Series is a machine platform for laser depaneling of rigid and flex PCBs. A hard stone base allows for maximum stability and precision. Different beam sources are available to adapt the laser cutting process to the substrate material. The system is available as a stand-alone manual loading system or fully ...

Specifications
Work Area / Panel Length: 305 mm
Work Area / Panel Width: 250 mm
Work Area / Panel Thickness (Max): 16 mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
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IRLD Inline Rotary Laser Depaneler
GETECH
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IRLD Inline Rotary Laser Depaneler
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IRLD is an inline laser depaneling machine specifically designed to depanel and/or singulate rigid and semi-flexible PCBs with high precision and repeatability. It is suitable for handling densely populated printed circuit board assemblies (PCBA) in automatic production assembly lines. The system consists of up to 4 high-speed ...

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): 1.0 mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
Data Sheet
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Laser Depaneling PCB Machine HDZ- UVC3030
Han's Laser Corporation
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Laser Depaneling PCB Machine HDZ- UVC3030
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Laser depaneling machine for PCB and related industry. A turn-key design. Our UV laser depaneling machine is assembled with a state-of-the-art 355nm Draco laser module, with fine-tuning, which ensures consistent, high-quality cutting on the fiberglass material (FR4) and flexible PCB. The cold working method produces small ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
Data Sheet
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Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
Aurotek Corporation
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Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
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This is a dual function semi0automatic, laser depaneling and laser marking machine. It offers dust-free non-contact laser cutting and detachment of circuit boards from larger panels.

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
Data Sheet
Inquire Price
On FindLight marketplace you will find 4 different 50 x 50 mm^2 Laser Depaneling Machines from suppliers around the world. With just a few clicks you can compare different 50 x 50 mm^2 Laser Depaneling Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.