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  5. FR4

FR4 Laser Depaneling Machines

EVO DEPANEL
EMEA Electro Solutions
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EVO DEPANEL
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ACCURATE AND DUST FREE ROUTING SYSTEM FOR PCBA DEPANELING APPLICATION.

Specifications
Work Area / Panel Length: 310 mm
Work Area / Panel Width: 410 mm
Work Area / Panel Thickness (Max): 2 mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Data Sheet
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UV Laser Depaneling Machine For PCB - FPC - Printed Circuit Board YSV-6A
YUSH Electronic Technology Co.,Ltd
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UV Laser Depaneling Machine For PCB - FPC - Printed Circuit Board YSV-6A
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This systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers. 

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): 11 mm
Scan Field: Not specified
Scan Speed: -- mm/sec
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Two Axis Table Laser PCB Depaneling Machine
Winsmart Electronic Co.,Ltd
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Two Axis Table Laser PCB Depaneling Machine
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This PCB Laser Depaneling equipment is integrated with high-stability and the best performance UV laser generator. The equipment delivers great working area focus, power distribution ratio and small thermal affection that gives small cutting width and high cutting quality during processing. With a sophisticated two-axis table ...

Specifications
Work Area / Panel Length: 460 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
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ZMLS1000 Genitec PCBA-FPC Laser Depaneling Machine
GENITEC DONGGUAN CO.,LTD
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ZMLS1000 Genitec PCBA-FPC Laser Depaneling Machine
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Genitec We are PCB separator expert. We provide PCB depaneling total solution. Genitec founded in Taiwan in 1993. We have two factories for over 20000 square meters. We produce most kind of PCB separator. Including PCB router, laser PCB separator, V-cut, PCB/FPC punching machine. If you have any project about PCB depaneling, welcome ...

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Data Sheet
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DIVISIO 8000 Machine Platform For Laser Depaneling
SDG S.r.l.
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DIVISIO 8000 Machine Platform For Laser Depaneling
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The DIVISIO 8000 Series is a machine platform for laser depaneling of rigid and flex PCBs. A hard stone base allows for maximum stability and precision. Different beam sources are available to adapt the laser cutting process to the substrate material. The system is available as a stand-alone manual loading system or fully ...

Specifications
Work Area / Panel Length: 305 mm
Work Area / Panel Width: 250 mm
Work Area / Panel Thickness (Max): 16 mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
Data Sheet
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DirectLaser S6 Laser Depaneling Machine
DCT Laser Solutions GmbH
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DirectLaser S6 Laser Depaneling Machine
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Laser depaneling opens up a whole new world of opportunities regarding precision, reliability, flexibility and cost efficiency of PCBs. Laser routing of populated flexible, flex-rigid and thin rigid PCBs significantly reduces the cost of your PCBs. No cutting dyes are needed for flexible PCBs. On rigid PCB panels the millimeter ...

Specifications
Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Data Sheet
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LOW Laser Depaneling machine
Systemtechnik Hölzer GmbH
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LOW Laser Depaneling machine
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The highly dynamic LOW laser depaneling machine is especially suitable for medium to high product volumes and meets growing requirements in the production process. Printed circuit boards of various materials are made using low-dust, low-stress laser sawing and milling techniques separated with maximum product flexibility, ...

Specifications
Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Data Sheet
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Laser Depaneling PCB Machine HDZ- UVC3030
Han's Laser Corporation
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Laser Depaneling PCB Machine HDZ- UVC3030
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Laser depaneling machine for PCB and related industry. A turn-key design. Our UV laser depaneling machine is assembled with a state-of-the-art 355nm Draco laser module, with fine-tuning, which ensures consistent, high-quality cutting on the fiberglass material (FR4) and flexible PCB. The cold working method produces small ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
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PCB Laser Depaneling System
Hylax Technology Pte Ltd
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PCB Laser Depaneling System
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With the advent of new and high power plus lower cost UV lasers there is greater adoption of cutting of materials like printed circuit boards. This boards may be produced from fiber glass materials like FR4 or for thin flexible circuits they may be fabricated from polyimide or kapton. This process can now be ...

Specifications
Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Data Sheet
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MicroCut 1000 Offline LASER Depaneling
Martintrier Technology
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MicroCut 1000 Offline LASER Depaneling
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MicroCut 1000 Offline LASER is an automatic laser depaneling system for printed circuit boards. It offers clean and stress-free detachment of individual boards from an array of boards on a large panel. 

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 200 mm/sec
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Laser PCB Depaneling Machine
HGLaser Engineering Co,.Ltd.
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Laser PCB Depaneling Machine
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Laser depaneling uses the focused high power density laser beam to irradiate workpiece. Under the laser power density exceeding a specific threshold, enough heat is absorbed by the panel which causes the panel material to form microscopic pores through a gasification process. As the laser beam passes through a predefined trajectory, ...

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: -- mm/sec
Data Sheet
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FPC Precision Laser Depaneling Machine Series MS0404-V-B
GD HANS YUEMING LASER TECH CO.,LTD
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FPC Precision Laser Depaneling Machine Series MS0404-V-B
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This precision laser cutting machine (laser depaneling machine) offers non-contact processing; it will not produce any mechanical deformation and can process arbitrarily complex graphics, while shortening delivery time. The built-in high performance CCD enable auto-location, auto-correction and i suitable for high precision ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Data Sheet
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Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
Aurotek Corporation
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Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
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This is a dual function semi0automatic, laser depaneling and laser marking machine. It offers dust-free non-contact laser cutting and detachment of circuit boards from larger panels.

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
Data Sheet
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Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
Shenzhen Herolaser Equipment Co., Ltd.
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Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
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This is a laser system that is used for depaneling, separating, and singulating of individual circuit boards from an array of many boards on one large panel. It is an alternative method with distinct advantages over other forms of PCB depaneling such as routers, dicing saws or die punches. PCB laser cutting uses a high-powered beam ...

Specifications
Work Area / Panel Length: 450 mm
Work Area / Panel Width: 450 mm
Work Area / Panel Thickness (Max): 0.4 mm
Scan Field: Not specified
Scan Speed: 2000 mm/sec
Data Sheet
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NEOCUT SHAPE Laser Depaneling Machine
Osai Automation System
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NEOCUT SHAPE Laser Depaneling Machine
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This is a Laser Depaneling Machine. The flexible circuit market is primarily driven by the demand for smaller and lighter products; those FPCBs require tighter tolerances and smaller spacing to cut the board after component placement.NeoCut Shape performs highly accurate cutting operations, without mechanical ...

Specifications
Work Area / Panel Length: 480 mm
Work Area / Panel Width: 480 mm
Work Area / Panel Thickness (Max): 3.5 mm
Scan Field: 100 x 100 mm^2
Scan Speed: -- mm/sec
Data Sheet
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Laser Depaneling Machine LS-NUN
MSTEC Europe
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Laser Depaneling Machine LS-NUN
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Laser Depaneling Machine: Best cutting quality and excellent performance PCB board routing and cutting use Laser sourceSupport hybrid type PCB board (FPCB, Rigid-Flex PCB)Minimize particles because of non-contact cuttingHigh cutting quality compare on the contact type router (100um –> under 30 um)Support the complex shape ...

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 250 mm
Work Area / Panel Thickness (Max): 1.6 mm
Scan Field: 100 x 100 mm^2
Scan Speed: 2500 mm/sec
Data Sheet
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On FindLight marketplace you will find 16 different FR4 Laser Depaneling Machines from suppliers around the world. With just a few clicks you can compare different FR4 Laser Depaneling Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.