Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
Description
This is a dual function semi0automatic, laser depaneling and laser marking machine. It offers dust-free non-contact laser cutting and detachment of circuit boards from larger panels.
Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
Specifications |
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|---|---|
| Work Area / Panel Length: | 350 mm |
| Work Area / Panel Width: | 350 mm |
| Work Area / Panel Thickness (Max): | -- mm |
| Scan Field: | 50 x 50 mm^2 |
| Scan Speed: | -- mm/sec |
| Laser Output Power: | 10 W |
| Laser Wavelength: | -- nm |
| Axis Speed (X): | 1000 mm/sec |
| Axis Speed (Y): | 1000 mm/sec |
| Axis Speed (Z): | 1000 mm/sec |
| Accuracy: | 25 um |
| Panel Material: | FR4, FPCB, Rigid PCB, Double-Sided PCB |
Features
- Accuracy ± 25 μm (1 Mil)
- Axes Driving speed up to 1000mm/sec
- Laser marking & depaneling All-in-One
- Configurable Laser Source per demand
- Apply to Flexible, Rigid, Flex-rigid PCB
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Taiwan
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The Laser Depaneling and Marking Machine Semi-Automatic LSO 3000G is a dual function machine that offers dust-free non-contact laser cutting and detachment of circuit boards from larger panels, as well as laser marking capabilities.
The accuracy of the Laser Depaneling and Marking Machine is ± 25 μm (1 Mil).
This machine can be used for flexible, rigid, and flex-rigid PCBs.
The machine has a driving speed of up to 1000mm/sec.
The machine can be configured with different laser sources based on demand, including a 10W green laser (cutting thickness ≤ 0.6mm), a 20W green laser (cutting thickness ≤ 1.5mm), and a 12W UV laser (cutting thickness ≤ 1mm).