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Laser Depaneling Machines

Standing out from numerous brands, such as LPKF Cutting Master, R-TEK RTC series, Hans Laser HDZ-UVC3030,etc., Veshay WXR-220US is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing. 

Specifications

Work Area / Panel Length: 500 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 1 mm
Scan Field: 50 x 50 mm^2
Scan Speed: 3000 mm/sec
The WXR-220UD is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing. This dual-platform machine offers exceptional precision, speed, and compatibility, making it an ideal solution for cutting and depaneling flexible and rigid circuit boards. With an integrated laser cutting ...

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 500 mm
Work Area / Panel Thickness (Max): 2 mm
Scan Field: Other (see specs)
Scan Speed: 300 mm/sec
Genitec We are PCB separator expert. We provide PCB depaneling total solution. Genitec founded in Taiwan in 1993. We have two factories for over 20000 square meters. We produce most kind of PCB separator. Including PCB router, laser PCB separator, V-cut, PCB/FPC punching machine. If you have any project about PCB depaneling, welcome ...

Specifications

Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Not specified
Scan Speed: Not Specified

Frequently Asked Questions

One of the most cutting-edge methods for separating printed circuit boards (PCBs) from the entire panel of arrays is referred to as laser depaneling. Printed circuit boards (PCBs) that have already been manufactured in arrays on large panels require a careful separation before they can be used as individual electronic components. Laser depaneling machines are specially designed laser cutters with CNC capabilities that allow an automated cutting (detachment) of PCBs from larger panels

As you consider adopting laser depaneling machines for your PCB fabrication process you should take into account the total cost of ownership to calculate the proper unit economics. Laser depaneling is a clean, environmentally friendly process that can save on consumables. It also will save you on scrap costs thanks to a high degree of accuracy and repeatability. In a long run the cost of ownership can be justified depending on volume production and the machinery used. Because of the great variance in the range of parameters and features the price on individual machines can vary significantly. Please do not hesitate to inquire pricing on any model of interest.

Laser depaneling offers high-precision cuts, free of dust and carbonization. Thanks to its minimally invasive approach it can depanel PCBs with no mechanical stress or damage due to non-contact and vibration-free separation. Its high accuracy and repeatability allows fabricating with minimal scrap and material usage.

There are several parameters and options to look for when choosing the right laser depaneling system for your applications. Work and scan fields are two important parameters that along with max cutting speed will determine you production capacity. Laser output, including the source (fiber, CO2, DPSS, etc.), the output power and the wavelength will determine the list of materials that they can operate on. Before selecting a machine, please ensure that it is designed to cut through the material you intend to cut.

Laser depaneling offers unique features that are advantages over mechanical methods of cutting. This includes the high production speed leading to increased output, lower cost of ownership in the long term, less material usage (thanks to scrap savings and the absence of consumable), high precision and accuracy.

Laser depaneling machines can operate on most common PCB board materials including on FFR4, FPCB, Ceramics, SIP, PTFE, Metal, Rigid PCB, Double-Sided PCB, etc. If in doubt, please do not hesitate to inquire; suppliers on FindLight will be eager to respond to your questions.

Precision and Efficiency: The Role of Laser Depaneling Machines in Modern Electronics Manufacturing

In the rapidly evolving electronics industry, the demand for precision, efficiency, and reliability has never been higher. Laser depaneling machines have emerged as a critical solution, offering unparalleled accuracy and speed in separating individual printed circuit boards (PCBs) from larger panels.​

Understanding Laser Depaneling

Laser depaneling is a non-contact method that utilizes focused laser beams to cut PCBs from a fabricated panel. Unlike traditional mechanical methods, such as routing or die-cutting, laser depaneling eliminates physical stress on the boards, reducing the risk of damage to delicate components.​

The process involves directing a laser beam along predefined paths, precisely cutting through the substrate material. This technique ensures clean edges, minimal thermal impact, and high repeatability, making it ideal for complex and sensitive electronic assemblies.​

Advantages of Laser Depaneling Machines

  • High Precision: Laser depaneling achieves micron-level accuracy, essential for densely populated and miniaturized PCBs.​

  • Stress-Free Processing: The non-contact nature of laser cutting prevents mechanical stress, preserving the integrity of components and solder joints.​

  • Versatility: Capable of handling various materials, including FR4, polyimide, ceramics, and flexible PCBs, laser depaneling machines cater to diverse manufacturing needs.​

  • Clean and Burr-Free Edges: The precision of laser cutting results in smooth edges without burrs, reducing the need for post-processing.​

  • Reduced Waste: The accuracy of laser depaneling minimizes material waste, contributing to cost savings and environmental sustainability.​

Applications Across Industries

Laser depaneling machines are integral to numerous sectors:​

  • Consumer Electronics: Manufacturing smartphones, tablets, and wearable devices that require compact and intricate PCBs.​

  • Automotive Industry: Producing electronic control units and sensor modules with high reliability standards.​

  • Medical Devices: Creating precise and reliable PCBs for diagnostic equipment and implantable devices.​

  • Aerospace and Defense: Fabricating complex electronic systems where precision and durability are paramount.​

Selecting the Right Laser Depaneling Machine

When choosing a laser depaneling machine, consider the following factors:

  • Material Compatibility: Ensure the machine can process the specific materials used in your PCBs.​

  • Laser Type: Different lasers (e.g., UV, CO₂, fiber) offer varying advantages depending on the application.​

  • Cutting Speed and Accuracy: Evaluate the machine's performance metrics to match your production requirements.​

  • Automation and Integration: Look for machines that can seamlessly integrate into existing production lines and offer automation features.​

  • Maintenance and Support: Consider the availability of technical support and the ease of maintenance to ensure long-term reliability.​

Conclusion

Laser depaneling machines represent a significant advancement in PCB manufacturing, offering unmatched precision, efficiency, and flexibility. By adopting this technology, manufacturers can enhance product quality, reduce operational costs, and meet the growing demands of modern electronics production. Explore the range of laser depaneling machines on FindLight to find the solution that best fits your operational needs.

Did You know?

Laser Depaneling Machines (also known as PCB Depaneling Machines) are special laser cutting systems to carefully detach printed circuit boards (PCBs) from the panel they are printed on. In mass manufacturing PCBs are printed on a relatively large panel with batches. To make individual circuit boards those units need to be cut out (“depaneled”) from the array of circuits on the panel. Thanks to advances of laser as well as laser beam delivery technologies PCB laser depaneling has become the current standard in electronic manufacturing industry. The cutting precision offered by current laser sources offers unmatched precision in the slicing process. Availability of sources in a wide spectral range from UV to IR ensures operating capability on nearly any surface. Similarly, laser beam delivery technology offer X-Y-Z scanning capabilities with micron level precision.