Laser Depaneling PCB Machine HDZ- UVC3030
Description
Laser depaneling machine for PCB and related industry. A turn-key design. Our UV laser depaneling machine is assembled with a state-of-the-art 355nm Draco laser module, with fine-tuning, which ensures consistent, high-quality cutting on the fiberglass material (FR4) and flexible PCB.
The cold working method produces small heat-affected zones(HAZ), minimizes the charring, and makes minimal mechanical and thermal stress, distortion-free. SW control can quickly process any complex contours, no die cost, equipped with user-friendly software support with a quick parameter setting that produces a clean cut without damaging the substrate and components of the PCBA. A 2D bar code and serial numbers can be marked with the machine.
Laser Depaneling PCB Machine HDZ- UVC3030
Specifications |
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|---|---|
| Work Area / Panel Length: | 400 mm |
| Work Area / Panel Width: | 300 mm |
| Work Area / Panel Thickness (Max): | -- mm |
| Scan Field: | 50 x 50 mm^2 |
| Scan Speed: | -- mm/sec |
| Laser Output Power: | 15-20 W |
| Laser Wavelength: | 355 nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | 3 um |
| Panel Material: | FR4, FPCB, Ceramics, Rigid PCB, Double-Sided PCB |
Features
- UV laser processing is non-contact processing, stress-free, and will not deform the board
- It will not produce dust, the cutting edges are smooth and tidy, and there will be no burrs
- PCBA processing is achievable
- Any graphics can be processed by Han's Laser specified software
- Capable of making FPC, Rigid printed circuit board laser singulation
- A two-dimensional linear moving stage and high-resolution CCD guarantees high accuracy and precision
- The cutting capacity of the machine is up to 0.004" to 0.07" thickness
- Able to mark 1D, 2D barcode, GS1 code, Series numbers
- X-out marking is available as an optional extension
- Selectable working field size and laser power to meet specific demand
- Complies with the SMEMA standard
Applications
- Rigid FR4, Flexible printed circuit boards, PCBs
- Glass substrates
- Ceramic
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
China
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Sold by:
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On FindLight:
External Vendor
Claim Han's Laser Corporation Page to edit and add data
Frequently Asked Questions
The UV laser used in the machine has a wavelength of 355 nm.
The UV laser can cut and mark materials such as FR4 substrates, imitation resin-based materials, polyimide, ceramics, PTFE, polyester, aluminum, brass, and copper.
No, the laser depaneling machine does not produce any dust during the cutting process.
Yes, the machine can process complex contours with the help of its SW control and user-friendly software support.
The cutting capacity of the machine is up to 0.004" to 0.07" thickness.