LOW Laser Depaneling machine
Description
The highly dynamic LOW laser depaneling machine is especially suitable for medium to high product volumes and meets growing requirements in the production process.
Printed circuit boards of various materials are made using low-dust, low-stress laser sawing and milling techniques separated with maximum product flexibility, precision and throughput. Highly dynamic linear motor axes, tools and grippers meet the highest quality standards and guarantee the depaneling machine a long service life and reliability.
LOW Laser Depaneling machine
Specifications |
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|---|---|
| Work Area / Panel Length: | -- mm |
| Work Area / Panel Width: | -- mm |
| Work Area / Panel Thickness (Max): | -- mm |
| Scan Field: | Not specified |
| Scan Speed: | -- mm/sec |
| Laser Output Power: | -- W |
| Laser Wavelength: | -- nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | -- um |
| Panel Material: | FR4, FPCB, Rigid PCB, Double-Sided PCB |
Features
- Large work surface
- Rigid welded steel frame
- Highly dynamic linear motor axis
- Quick product change possible
- Flexible PCB mounting systems
- Cutting processes with discs, shaft tools and lasers
- Separates any PCB material
- Laser axis measurement
- Individual special sizes possible
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Germany
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Sold by:
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On FindLight:
External Vendor
Claim Systemtechnik Hölzer GmbH Page to edit and add data
Frequently Asked Questions
The LOW laser depaneling machine is used for separating printed circuit boards of various materials using low-dust, low-stress laser sawing and milling techniques.
The features of the LOW laser depaneling machine include a large work surface, a rigid welded steel frame, highly dynamic linear motor axis, quick product change capability, flexible PCB mounting systems, cutting processes with discs, shaft tools, and lasers, the ability to separate any PCB material, laser axis measurement, and the option for individual special sizes.
The LOW laser depaneling machine offers maximum product flexibility, precision, and throughput. It meets high-quality standards, has a long service life, and provides reliability in the production process.
Yes, the LOW laser depaneling machine can handle individual special sizes, allowing for flexibility in accommodating various sizes of printed circuit boards.
You can contact the manufacturer, Systemtechnik Hölzer GmbH, by phone at +49 (0)6173-92490 or by email at vertrieb@hoelzer.de.