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Not specified Laser Depaneling Machines

FPC Laser Depaneling Machine
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical ...

Specifications

Work Area / Panel Length: 600 mm
Work Area / Panel Width: 450 mm
Work Area / Panel Thickness (Max): 1.2 mm
Scan Field: Not specified
Scan Speed: -- mm/sec
De-Panel PCB Laser Depaneling Machine
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
This is a PCB Laser Depaneling Machine. It offers intelligent automation. Using built-in high-precision CCD camera you can easily locate and focus.Positioning is fast and accurate, without manual intervention. It offers simple operation, with a one-button mode which greatly improves production efficiency. With an automatic ...

Specifications

Work Area / Panel Length: 600 mm
Work Area / Panel Width: 450 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
EVO DEPANEL
EMEA Electro Solutions
ACCURATE AND DUST FREE ROUTING SYSTEM FOR PCBA DEPANELING APPLICATION.

Specifications

Work Area / Panel Length: 310 mm
Work Area / Panel Width: 410 mm
Work Area / Panel Thickness (Max): 2 mm
Scan Field: Not specified
Scan Speed: -- mm/sec
UV Laser Depaneling Machine For PCB - FPC - Printed Circuit Board YSV-6A
YUSH Electronic Technology Co.,Ltd
This systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers. 

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): 11 mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Genitec We are PCB separator expert. We provide PCB depaneling total solution. Genitec founded in Taiwan in 1993. We have two factories for over 20000 square meters. We produce most kind of PCB separator. Including PCB router, laser PCB separator, V-cut, PCB/FPC punching machine. If you have any project about PCB depaneling, welcome ...

Specifications

Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
DirectLaser S6 Laser Depaneling Machine
DCT Laser Solutions GmbH
Laser depaneling opens up a whole new world of opportunities regarding precision, reliability, flexibility and cost efficiency of PCBs. Laser routing of populated flexible, flex-rigid and thin rigid PCBs significantly reduces the cost of your PCBs. No cutting dyes are needed for flexible PCBs. On rigid PCB panels the millimeter ...

Specifications

Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
LOW Laser Depaneling machine
Systemtechnik Hölzer GmbH
The highly dynamic LOW laser depaneling machine is especially suitable for medium to high product volumes and meets growing requirements in the production process. Printed circuit boards of various materials are made using low-dust, low-stress laser sawing and milling techniques separated with maximum product flexibility, ...

Specifications

Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
LPKF CuttingMaster 3000 Ci
LPKF Laser & Electronics AG
Characterized by its high efficiency, performance and quality of cut edges, the CuttingMaster 3000 is a depaneling machine that delivers the best results for almost any cutting task. The CuttingMaster 3000 has several variants that operate with pulse durations in the nanosecond and even picosecond range. The laser power can ...

Specifications

Work Area / Panel Length: 460 mm
Work Area / Panel Width: 305 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
DIVIDOS HIGH SPEED LASER DEPANELING SOLUTION
InnoLas Solutions GmbH
The DIVIDOS series meets all requirements for laser depaneling of rigid and flexible printed circuit boards and separates different materials extremely fast, stress-free and without residues. In the FULL CUT process (cut without webs), up to 300% more panels can be provided on a PCB and separated in this way, depending on the PCB ...

Specifications

Work Area / Panel Length: 457 mm
Work Area / Panel Width: 457 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Control Micro Systems UV Laser Depaneler
Control Micro Systems Inc
CMS Laser has successfully developed two types of laser depaneling systems that included an in-line conveyor and a semi-automatic manual load system. Either design can be integrated with a CO2 or UV laser head depending on application requirements. Both designs include an integrated vision system, are CDRH Class I ...

Specifications

Work Area / Panel Length: 508 mm
Work Area / Panel Width: 457 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
PCB Laser Depaneling System
Hylax Technology Pte Ltd
With the advent of new and high power plus lower cost UV lasers there is greater adoption of cutting of materials like printed circuit boards. This boards may be produced from fiber glass materials like FR4 or for thin flexible circuits they may be fabricated from polyimide or kapton. This process can now be ...

Specifications

Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
FPC Precision Laser Depaneling Machine Series MS0404-V-B
GD HANS YUEMING LASER TECH CO.,LTD
This precision laser cutting machine (laser depaneling machine) offers non-contact processing; it will not produce any mechanical deformation and can process arbitrarily complex graphics, while shortening delivery time. The built-in high performance CCD enable auto-location, auto-correction and i suitable for high precision ...

Specifications

Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
Shenzhen Herolaser Equipment Co., Ltd.
This is a laser system that is used for depaneling, separating, and singulating of individual circuit boards from an array of many boards on one large panel. It is an alternative method with distinct advantages over other forms of PCB depaneling such as routers, dicing saws or die punches. PCB laser cutting uses a high-powered beam ...

Specifications

Work Area / Panel Length: 450 mm
Work Area / Panel Width: 450 mm
Work Area / Panel Thickness (Max): 0.4 mm
Scan Field: Not specified
Scan Speed: 2000 mm/sec
LPKF CuttingMaster 2000 Ci
LPKF Laser & Electronics AG
This UV laser system is ideal for cutting flexible, rigid-flexible and rigid printed circuit boards. Users benefit from the advantages of laser technology: the cuts are precisely positioned, there is a high degree of design freedom, and the surrounding material remains free of mechanical stress. The systems of the LPKF ...

Specifications

Work Area / Panel Length: 350 mm
Work Area / Panel Width: 250 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
On FindLight marketplace you will find 14 different Not specified Laser Depaneling Machines from suppliers around the world. With just a few clicks you can compare different Not specified Laser Depaneling Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.