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  4. Laser Depaneling Machines

Page 2 - Laser Depaneling Machines

FPC Precision Laser Depaneling Machine Series MS0404-V-B
GD HANS YUEMING LASER TECH CO.,LTD
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FPC Precision Laser Depaneling Machine Series MS0404-V-B
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This precision laser cutting machine (laser depaneling machine) offers non-contact processing; it will not produce any mechanical deformation and can process arbitrarily complex graphics, while shortening delivery time. The built-in high performance CCD enable auto-location, auto-correction and i suitable for high precision ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Data Sheet
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Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
Aurotek Corporation
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Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
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This is a dual function semi0automatic, laser depaneling and laser marking machine. It offers dust-free non-contact laser cutting and detachment of circuit boards from larger panels.

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
Data Sheet
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Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
Shenzhen Herolaser Equipment Co., Ltd.
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Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
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This is a laser system that is used for depaneling, separating, and singulating of individual circuit boards from an array of many boards on one large panel. It is an alternative method with distinct advantages over other forms of PCB depaneling such as routers, dicing saws or die punches. PCB laser cutting uses a high-powered beam ...

Specifications
Work Area / Panel Length: 450 mm
Work Area / Panel Width: 450 mm
Work Area / Panel Thickness (Max): 0.4 mm
Scan Field: Not specified
Scan Speed: 2000 mm/sec
Data Sheet
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LPKF CuttingMaster 2000 Ci
LPKF Laser & Electronics AG
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LPKF CuttingMaster 2000 Ci
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This UV laser system is ideal for cutting flexible, rigid-flexible and rigid printed circuit boards. Users benefit from the advantages of laser technology: the cuts are precisely positioned, there is a high degree of design freedom, and the surrounding material remains free of mechanical stress. The systems of the LPKF ...

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 250 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
Data Sheet
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NEOCUT SHAPE Laser Depaneling Machine
Osai Automation System
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NEOCUT SHAPE Laser Depaneling Machine
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This is a Laser Depaneling Machine. The flexible circuit market is primarily driven by the demand for smaller and lighter products; those FPCBs require tighter tolerances and smaller spacing to cut the board after component placement.NeoCut Shape performs highly accurate cutting operations, without mechanical ...

Specifications
Work Area / Panel Length: 480 mm
Work Area / Panel Width: 480 mm
Work Area / Panel Thickness (Max): 3.5 mm
Scan Field: 100 x 100 mm^2
Scan Speed: -- mm/sec
Data Sheet
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Laser Depaneling Machine LS-NUN
MSTEC Europe
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Laser Depaneling Machine LS-NUN
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Laser Depaneling Machine: Best cutting quality and excellent performance PCB board routing and cutting use Laser sourceSupport hybrid type PCB board (FPCB, Rigid-Flex PCB)Minimize particles because of non-contact cuttingHigh cutting quality compare on the contact type router (100um –> under 30 um)Support the complex shape ...

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 250 mm
Work Area / Panel Thickness (Max): 1.6 mm
Scan Field: 100 x 100 mm^2
Scan Speed: 2500 mm/sec
Data Sheet
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