Two Axis Table Laser PCB Depaneling Machine
Description
This PCB Laser Depaneling equipment is integrated with high-stability and the best performance UV laser generator. The equipment delivers great working area focus, power distribution ratio and small thermal affection that gives small cutting width and high cutting quality during processing.
With a sophisticated two-axis table and closed loop control module, it ensures fast cutting while maintaining micron level of precision with modern technology of position sensors and CCD image capture application.
As boards become thinner, smaller and more sophisticated, these methods expose PCB parts to mechanical stress resulting in board breakage and lowering throughput if not handled carefully. This laser depaneling system ensures delicate handling and cutting process.
Two Axis Table Laser PCB Depaneling Machine
Specifications |
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|---|---|
| Work Area / Panel Length: | 460 mm |
| Work Area / Panel Width: | 460 mm |
| Work Area / Panel Thickness (Max): | -- mm |
| Scan Field: | Other (see specs) |
| Scan Speed: | 2500 mm/sec |
| Laser Output Power: | 15 W |
| Laser Wavelength: | 355 nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | 2 um |
| Panel Material: | FR4, FPCB, Rigid PCB, Double-Sided PCB |
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
China
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Sold by:
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On FindLight:
External Vendor
Claim Winsmart Electronic Co.,Ltd Page to edit and add data
Frequently Asked Questions
The working area of the machine is 460x460mm.
The machine has a positioning precision of 2μM.
The UV laser generator provides a small cutting width and high cutting quality with minimal thermal affection.
The disadvantages of traditional depaneling solutions include lower quality cuts, PCB damage due to accumulated debris, constant need for new bits/dies/blades, limitations for boards smaller than 500µm, and inability to cut complex, multidimensional PCBs.
The system utilizes a sophisticated two-axis table and closed loop control module, along with modern technology of position sensors and CCD image capture application, to ensure fast cutting while maintaining micron level of precision.