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  4. Laser Dicing Machines

Laser Dicing Machines

Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
Han's Laser Corporation
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Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
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The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine. The core principle of non-destructive laser cutting is laser thermal stress-controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the ...

Specifications
Wafer Size: 150 mm (~6 in), 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 150 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 120 um
Data Sheet
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TITANIUM 5 Axis Laser Dicing Machine
OGI Systems LTD
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TITANIUM 5 Axis Laser Dicing Machine
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Titanium is the most precise Laser Dicing Machine for ultra-hard materials and excellent to processed PCD, CBN, PCBN and CVD DIAMOND tools. With Titanium easy to create any abrasives tools for honing ring, grinding wheels, Milling Cutter, cutting inserts, Gear Cutting Tools, Chamfer & Deburring Tools, CBN Insert and more.The ...

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 200 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: -- um
Data Sheet
Inquire Price

Frequently Asked Questions

Laser dicing is the process of cutting and removal of individual dies from large wafers. Laser dicing machines utilize near IR radiation to cut out individual dies from larger wafers. In a laser dicing machine laser beam is programmed to trace a contour line around individual dies. The energy deposited from the laser beam is absorbed by the wafer creating smooth cuts along the contour lines. Laser dicing machines also often come with automated die handling mechanism that allow safe handling of the delicate dies without breakage.

In addition to laser dicing, there are other wafer cutting technologies including mechanical sawing, scribing and plasma dicing.

Yes, laser dicing is often referred to as stealth dicing. Please contact us and let us know if you know the origin of the term “stealth dicing”.

Laser dicing is a non-contact procedure that offers smooth cut lines and lacks the debris generated in other cutting methods such as mechanical sawing or scribing. The non-contact nature of the process and the precise control of the laser parameters also mean that the cuts are more precise and throughput is maximized through elimination of scraps. Moreover, cuts made with laser dicing are also characterized with low kerf thus minimizing the waste.

While many regular laser cutters are capable of cutting through wafers, it is not advisable to use them for wafer dicing purposes in large scale projects. This is because they lack the die handling technology to effectively handle the wafers and dies without breakage. Additionally, the laser parameters and the CNC control technology of regular laser cutting machines lack the sophistication and the peculiarities needed for wafer dicing.

Plasma dicing is another technology for separating dies out of wafers. It employs a chemical etching process using fluorine plasma to scribe/etch lines along the contour lines of the dies. Upon scribing the contour lines the dies can be separated from the wafers and handled usually. Plasma dicing is considered a high throughput alternative for wafer dicing.

There are 2 different Laser Dicing Machines from suppliers and manufacturers listed in this category. In just a few clicks you can compare different Laser Dicing Machines with each other and get an accurate quote based on your needs and specifications. Please note that the prices of Laser Dicing Machines vary significantly for different products based on various factors including technical parameters, features, brand name, etc. Please contact suppliers directly to inquire about the details and accurate pricing information for any product model. Simply navigate to the product page of interest and use the orange button to directly reach out to the respective supplier with one click.

Did You know?

Laser dicing machines are specialty laser workstations designed to cut out dies from a wafer for semiconductor manufacturing. There are several different mechanisms/methods currently used for wafer dicing, including scribing and breaking, mechanical sawing and laser cutting. Most modern dicing machines come with sophisticated handling mechanisms that minimize breakage and scrap. Dicing process involves scribing grooves. Upon dicing the individual dies are removed using a special die-handling mechanism that is often integrated into the entire manufacturing process. During laser dicing (a.k.a. stealth dicing) the laser beam traces the contour being cut after which the membrane that holds the dice expands and fractures the wafer along the cut lines. Laser dicing machines typically utilize the IR output of Nd:YAG or Nd:YLF lasers. The 1.06 um output wavelength is well suited for processing silicon, which has an electronic bandgap within the same spectral region. Compared with other wafer dicing systems, laser dicing machines offer non-contact cutting and do not require cooling. The laser cuts are also more precise and without debris, which is present in the mechanical cutting process. The resulting kerf (the width of the cut) is also much smaller - 10um vs ~80um for mechanical wafer dicing equipment. This enables better utilization of the surface area for large volume applications.
External links:
1 - Introduction to Wafer Dicing
2 - What is Plasma Dicing?