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  4. Laser Dicing Machines
  5. ~ 6 kVA

~ 6 kVA Laser Dicing Machines

AD2000T-S Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
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AD2000T-S Fully Automatic Dicing Machine
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8-inches Fully Automatic Dicing Machine. Achieved smallest footprint possible utilizing our own core technology.

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 260 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
Data Sheet
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AD3000T-PLUS Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
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AD3000T-PLUS Fully Automatic Dicing Machine
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This is a Fully Automatic Dicing Machine capable of stealth dicing 12" wafers.Tokyo Seimitsu Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology.

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
Data Sheet
Inquire Price
On FindLight marketplace you will find 2 different ~ 6 kVA Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different ~ 6 kVA Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.