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  5. ~ 7 kVA

~ 7 kVA Laser Dicing Machines

ML301EXWH Laser Dicing Machine
TOKYO SEIMITSU CO., LTD
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ML301EXWH Laser Dicing Machine
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12-inches laser dicing machine with wafer handling system and visible light microscope.It's a fully integrated system that offers ease of operation, accuracy and high throughput.

Specifications
Wafer Size: 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 550 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 2 um
Data Sheet
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On FindLight marketplace you will find 1 different ~ 7 kVA Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different ~ 7 kVA Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.