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  2. Laser Material Processing
  3. Laser Cutters
  4. Laser Dicing Machines
  5. 300 mm (~12 in)

300 mm (~12 in) Laser Dicing Machines

Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
Han's Laser Corporation
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Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
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The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine. The core principle of non-destructive laser cutting is laser thermal stress-controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the ...

Specifications
Wafer Size: 150 mm (~6 in), 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 150 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 120 um
Data Sheet
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ML301EXWH Laser Dicing Machine
TOKYO SEIMITSU CO., LTD
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ML301EXWH Laser Dicing Machine
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12-inches laser dicing machine with wafer handling system and visible light microscope.It's a fully integrated system that offers ease of operation, accuracy and high throughput.

Specifications
Wafer Size: 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 550 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 2 um
Data Sheet
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AD3000T-PLUS Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
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AD3000T-PLUS Fully Automatic Dicing Machine
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This is a Fully Automatic Dicing Machine capable of stealth dicing 12" wafers.Tokyo Seimitsu Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology.

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
Data Sheet
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DFL7362 Fully Automatic Laser Saw
DISCO Corporation
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DFL7362 Fully Automatic Laser Saw
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Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si. DFL7362 is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 2000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 2000 mm/s
X-Axis Resolution: 0.1 um
Data Sheet
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microCELLTM TLS High-Throughput Laser System
3D Micromac
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microCELLTM TLS High-Throughput Laser System
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3D-Micromac is taking advantage of the Thermal Laser Separation™ (TLS) technology, especially for use cases within photovoltaic production. The patented process has gained importance in contrast to conventional separation techniques due to smooth and defect-free cutting edges. This leads to a significantly higher module power ...

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 300 mm
X-Axis Speed: 300 mm/s
X-Axis Resolution: -- um
Data Sheet
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microDICE Enabling TLS-DicingTM System
3D Micromac
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microDICE Enabling TLS-DicingTM System
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3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality ...

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): -- mm
X-Axis Speed: 300 mm/s
X-Axis Resolution: -- um
Data Sheet
Inquire Price
On FindLight marketplace you will find 6 different 300 mm (~12 in) Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different 300 mm (~12 in) Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.