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  5. 675 mm (26.6 in)

675 mm (26.6 in) Laser Dicing Machines

Silicon Wafer Laser Dicing and Scribing Machine
Shenzhen Beyond Laser Technology Co., Ltd
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Silicon Wafer Laser Dicing and Scribing Machine
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Silicon Wafer Laser Dicing and Scribing Machine is equipped with a picosecond laser and offer a high throughput, cost effective and simple way to dice and scribe wafers with high accuracy and long term reliability.Copper laminate wafers with multi-layers of different materials with varying hardness and density is difficult to ...

Specifications
Wafer Size: 450 mm (17.7 in), 675 mm (26.6 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 650 mm
X-Axis Speed: 800 mm/s
X-Axis Resolution: -- um
Data Sheet
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On FindLight marketplace you will find 1 different 675 mm (26.6 in) Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different 675 mm (26.6 in) Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.