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  5. Glass

Glass Laser Dicing Machines

Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
Han's Laser Corporation
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Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
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The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine. The core principle of non-destructive laser cutting is laser thermal stress-controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the ...

Specifications
Wafer Size: 150 mm (~6 in), 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 150 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 120 um
Data Sheet
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TITANIUM 5 Axis Laser Dicing Machine
OGI Systems LTD
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TITANIUM 5 Axis Laser Dicing Machine
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Titanium is the most precise Laser Dicing Machine for ultra-hard materials and excellent to processed PCD, CBN, PCBN and CVD DIAMOND tools. With Titanium easy to create any abrasives tools for honing ring, grinding wheels, Milling Cutter, cutting inserts, Gear Cutting Tools, Chamfer & Deburring Tools, CBN Insert and more.The ...

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 200 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: -- um
Data Sheet
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microCELLTM TLS High-Throughput Laser System
3D Micromac
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microCELLTM TLS High-Throughput Laser System
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3D-Micromac is taking advantage of the Thermal Laser Separation™ (TLS) technology, especially for use cases within photovoltaic production. The patented process has gained importance in contrast to conventional separation techniques due to smooth and defect-free cutting edges. This leads to a significantly higher module power ...

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 300 mm
X-Axis Speed: 300 mm/s
X-Axis Resolution: -- um
Data Sheet
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microDICE Enabling TLS-DicingTM System
3D Micromac
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microDICE Enabling TLS-DicingTM System
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3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality ...

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): -- mm
X-Axis Speed: 300 mm/s
X-Axis Resolution: -- um
Data Sheet
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Silicon Wafer Laser Dicing and Scribing Machine
Shenzhen Beyond Laser Technology Co., Ltd
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Silicon Wafer Laser Dicing and Scribing Machine
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Silicon Wafer Laser Dicing and Scribing Machine is equipped with a picosecond laser and offer a high throughput, cost effective and simple way to dice and scribe wafers with high accuracy and long term reliability.Copper laminate wafers with multi-layers of different materials with varying hardness and density is difficult to ...

Specifications
Wafer Size: 450 mm (17.7 in), 675 mm (26.6 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 650 mm
X-Axis Speed: 800 mm/s
X-Axis Resolution: -- um
Data Sheet
Inquire Price
On FindLight marketplace you will find 5 different Glass Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different Glass Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.