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Other Laser Dicing Machines

Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
Han's Laser Corporation
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Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
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The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine. The core principle of non-destructive laser cutting is laser thermal stress-controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the ...

Specifications
Wafer Size: 150 mm (~6 in), 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 150 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 120 um
Data Sheet
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TITANIUM 5 Axis Laser Dicing Machine
OGI Systems LTD
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TITANIUM 5 Axis Laser Dicing Machine
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Titanium is the most precise Laser Dicing Machine for ultra-hard materials and excellent to processed PCD, CBN, PCBN and CVD DIAMOND tools. With Titanium easy to create any abrasives tools for honing ring, grinding wheels, Milling Cutter, cutting inserts, Gear Cutting Tools, Chamfer & Deburring Tools, CBN Insert and more.The ...

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 200 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: -- um
Data Sheet
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ML301EXWH Laser Dicing Machine
TOKYO SEIMITSU CO., LTD
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ML301EXWH Laser Dicing Machine
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12-inches laser dicing machine with wafer handling system and visible light microscope.It's a fully integrated system that offers ease of operation, accuracy and high throughput.

Specifications
Wafer Size: 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 550 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 2 um
Data Sheet
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DFL7341 Fully Automatic Laser Saw
DISCO Corporation
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DFL7341 Fully Automatic Laser Saw
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Achieves high productivity for sapphire, lithium tantalate, and MEMS processing. Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to reliably process wafers with significant warpage. Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to ...

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: 1000 rpm
X-Axis Stroke (Cutting Range): 210 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: 0.1 um
Data Sheet
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On FindLight marketplace you will find 4 different Other Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different Other Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.