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  4. Laser Dicing Machines
  5. Silicon

Silicon Laser Dicing Machines

Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
Han's Laser Corporation
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Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
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The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine. The core principle of non-destructive laser cutting is laser thermal stress-controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the ...

Specifications
Wafer Size: 150 mm (~6 in), 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 150 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 120 um
Data Sheet
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TITANIUM 5 Axis Laser Dicing Machine
OGI Systems LTD
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TITANIUM 5 Axis Laser Dicing Machine
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Titanium is the most precise Laser Dicing Machine for ultra-hard materials and excellent to processed PCD, CBN, PCBN and CVD DIAMOND tools. With Titanium easy to create any abrasives tools for honing ring, grinding wheels, Milling Cutter, cutting inserts, Gear Cutting Tools, Chamfer & Deburring Tools, CBN Insert and more.The ...

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 200 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: -- um
Data Sheet
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AD2000T-S Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
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AD2000T-S Fully Automatic Dicing Machine
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8-inches Fully Automatic Dicing Machine. Achieved smallest footprint possible utilizing our own core technology.

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 260 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
Data Sheet
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ML301EXWH Laser Dicing Machine
TOKYO SEIMITSU CO., LTD
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ML301EXWH Laser Dicing Machine
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12-inches laser dicing machine with wafer handling system and visible light microscope.It's a fully integrated system that offers ease of operation, accuracy and high throughput.

Specifications
Wafer Size: 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 550 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 2 um
Data Sheet
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AD3000T-PLUS Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
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AD3000T-PLUS Fully Automatic Dicing Machine
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This is a Fully Automatic Dicing Machine capable of stealth dicing 12" wafers.Tokyo Seimitsu Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology.

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
Data Sheet
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DFL7341 Fully Automatic Laser Saw
DISCO Corporation
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DFL7341 Fully Automatic Laser Saw
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Achieves high productivity for sapphire, lithium tantalate, and MEMS processing. Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to reliably process wafers with significant warpage. Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to ...

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: 1000 rpm
X-Axis Stroke (Cutting Range): 210 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: 0.1 um
Data Sheet
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DFL7362 Fully Automatic Laser Saw
DISCO Corporation
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DFL7362 Fully Automatic Laser Saw
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Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si. DFL7362 is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 2000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 2000 mm/s
X-Axis Resolution: 0.1 um
Data Sheet
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microDICE Enabling TLS-DicingTM System
3D Micromac
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microDICE Enabling TLS-DicingTM System
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3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality ...

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): -- mm
X-Axis Speed: 300 mm/s
X-Axis Resolution: -- um
Data Sheet
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Silicon Wafer Laser Dicing and Scribing Machine
Shenzhen Beyond Laser Technology Co., Ltd
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Silicon Wafer Laser Dicing and Scribing Machine
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Silicon Wafer Laser Dicing and Scribing Machine is equipped with a picosecond laser and offer a high throughput, cost effective and simple way to dice and scribe wafers with high accuracy and long term reliability.Copper laminate wafers with multi-layers of different materials with varying hardness and density is difficult to ...

Specifications
Wafer Size: 450 mm (17.7 in), 675 mm (26.6 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 650 mm
X-Axis Speed: 800 mm/s
X-Axis Resolution: -- um
Data Sheet
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On FindLight marketplace you will find 9 different Silicon Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different Silicon Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.