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Frequently Asked Questions

The IMPACT-2012 Laser Drilling Machine is used for precision processing and drilling of non-metallic materials such as wire-stripping, drilling of pharmaceutical capsules, processing printed circuit boards, paint stripping, and surface cleaning.

The IMPACT-2012 Laser Drilling Machine uses short, high power pulses from TEA CO2 lasers, which have a different material interaction compared to long pulse and continuous CO2 lasers. This allows for high definition processing with excellent edge quality and selective removal of plastic materials from a metal backing.

The IMPACT-2012 Laser Drilling Machine offers a lower cost alternative to excimer lasers for many applications. It also provides reduced heat-affected-zone compared to conventional CO2 lasers and allows for selective removal of polymer materials from a metal substrate without damaging the metallic backing.

Some typical applications of the IMPACT-2012 Laser Drilling Machine include drilling, patterning, and ablation of non-metallic materials, selective removal of polymer materials from a metal substrate, wire stripping, drilling of pharmaceutical tablets and capsules, microvia-hole drilling in printed circuits, flex-circuit processing, and laser ultrasound non-destructive testing.

The IMPACT-2012 Laser Drilling Machine can be set to operate at either 10.6 µm (infrared wavelength) or in the 9 µm region, which usually provides superior processing quality for non-metallic/polymer materials.

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