μMark Laser
Description
μMark Laser
Specifications |
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Work Area X: | 203 mm |
Work Area Y: | 152 mm |
Beam Delivery: | Galvo |
Laser Source: | CO2 |
Laser Output Power: | -- W |
Laser Wavelength: | 10.6 um (IR) |
Marking Speed: | -- mm/sec |
Voltage Requirement: | 110V - 60Hz, 230V - 50Hz |
Materials: | Stainless Steel, Steel/Iron, Steel Alloy, Aluminum, Anodized Aluminum, Brass, Copper, Gold, Silver, Nickel, Titanium, Platinum |
Air Assist: | Included |
Fume Extraction Unit: | Optional |
Safety Enclosure: | Included |
Features
- Fast load and alignment
- Fast marking
- Characters and graphics
- Flat or curved wafers
- User friendly
- Low maintenance
- Up to 8" wafer diameter
- Chips down to 1x1mm
- CO2 or Nd:YAG lasers
- CDRH Class-1 system
Applications
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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Ships from:
Israel
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The μMark Laser System can handle wafer diameters up to 8 inches.
The μMark Laser System can mark chips as small as 1x1mm.
The μMark Laser System is used for marking Chip Size Packages (CSP) in a wafer form.
The μMark Laser System can use either a CO2 or a Nd:YAG laser.
The μMark Laser System comes with complete operating software for graphics and character editing, mark layout, wafer alignment manually and automatically, chip selection, parametric adjustments, marking test and more.