DFL7560L Laser Lift-Off Machine (DPSS Laser | Wide Homogenized Beam)
Description
DFL7560L Laser Lift-Off Machine (DPSS Laser | Wide Homogenized Beam)
Specifications |
|
|---|---|
| Laser Source: | DPSS |
| Wavelength: | -- nm |
| Laser Output Power: | -- W |
| Laser Pulse Energy: | -- mJ |
| Laser Pulse Duration: | -- ns |
| Laser Repetition Rate: | -- Hz |
| X-Axis Range: | 210 mm |
| Y-Axis Range: | 210 mm |
| Laser Line Length: | 210 mm |
| Laser Line Width: | 1 um |
Features
- Because processing is possible in a wide focal point range with optimum power using optics uniquely developed by DISCO, wafer damage and separation are reduced. Moreover, surface roughness after sapphire separation is extremely low.
- Compared to general separation equipment using gas lasers, maintenance time is drastically reduced and processing quality is more stable.
Applications
- Laser dicing
- Stealth dicing
- Wafer-die separation (singulation)
For pricing, technical or any other questions please contact the supplier
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- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
Japan
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The DFL7560L Laser Lift-Off Machine is used for laser dicing, stealth dicing, and wafer-die separation (singulation).
The DFL7560L Laser Lift-Off Equipment offers reduced wafer damage and separation due to its wide focal point range and optimum power. It also provides extremely low surface roughness after sapphire separation.
The DFL7560L achieves high processing speed and quality by using a DPSS (solid state) laser and optics uniquely developed by DISCO.
The DFL7560L requires drastically reduced maintenance time and provides more stable processing quality compared to general separation equipment using gas lasers.
The DFL7560L can handle workpieces up to Φ150 mm in size.