Laser Lift-Off System with DPSS Laser
Description
Laser Lift-Off System with DPSS Laser
Specifications |
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Laser Source: | DPSS |
Wavelength: | 343 nm |
Laser Output Power: | 800 W |
Laser Pulse Energy: | -- mJ |
Laser Pulse Duration: | -- ns |
Laser Repetition Rate: | -- Hz |
X-Axis Range: | 1500 mm |
Y-Axis Range: | 925 mm |
Laser Line Length: | 750 mm |
Laser Line Width: | 30 um |
Features
- Our original substrate transport stage technology brings high production capacity.
- Available Excimer laser (308 nm) and DPSS laser (343 nm)
- Process monitoring function (Judgment to detach or not)
- Turnkey operation
- Small footprint
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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Ships from:
Japan
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The Laser Lift-Off (LLO) system is used to detach a flexible display from a carrier glass substrate without applying stress to it.
A UV laser with a short wavelength is used because it can be absorbed at the only surface of the debonding layer, ensuring that laser irradiation does not affect the flexible display.
The Laser Lift-Off (LLO) system features high production capacity due to our original substrate transport stage technology. It is available with Excimer laser (308 nm) and DPSS laser (343 nm) options. It also has a process monitoring function for judgment on whether to detach or not, and it offers turnkey operation with automatic irradiation condition setting by AI. Additionally, it has a small footprint with a 40% reduction.
The Laser Lift-Off (LLO) system can accommodate substrates with a size of 1500 x 925 mm.
The Laser Lift-Off (LLO) system has been delivered to display companies in Japan, South Korea, China, and other countries for mass-production systems.