UVblade 250 Laser Lift-Off Processing
Description
UVblade 250 Laser Lift-Off Processing
Specifications |
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|---|---|
| Laser Source: | DPSS |
| Wavelength: | 308 nm |
| Laser Output Power: | 116 W |
| Laser Pulse Energy: | 580 mJ |
| Laser Pulse Duration: | -- ns |
| Laser Repetition Rate: | 200 Hz |
| X-Axis Range: | 250 mm |
| Y-Axis Range: | 250 mm |
| Laser Line Length: | 250 mm |
| Laser Line Width: | 200 um |
Features
- Cost effective solutions for Laser Lift-Off (LLO) separation
- Pulse on Demand (POD)
- Unmatched beam utilization
- Scalability in line lengths and energy density
- Flexible system footprint
Applications
- Laser Lift-Off Separation of Wafers and Displays
- Unique Lift-Off Solution for Transparent and Colorless Polyimide (CPI)
For pricing, technical or any other questions please contact the supplier
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- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
United States
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Frequently Asked Questions
The UVblade is used for Laser Lift-Off (LLO) separation of substrates and wafers in the manufacturing of flexible displays.
The UVblade offers cost-effective solutions for LLO separation, Pulse on Demand (POD) functionality, unmatched beam utilization, scalability in line lengths and energy density, and a flexible system footprint.
The UVblade is suitable for Laser Lift-Off separation of wafers and displays, as well as providing a unique Lift-Off solution for Transparent and Colorless Polyimide (CPI).
The UVblade is available in different models with varying wavelengths, laser pulse energy, repetition rate, energy density, beam length, beam width, homogeneity, and depth of focus.
More information about the UVblade can be found in the UVblade Datasheet available on the Coherent website or by contacting Coherent directly.