LS3 BASIC Laser Micromachining System
Description
LS3 BASIC Laser Micromachining System
Specifications |
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Materials: | Metals, Ceramics, Glass |
Laser Type: | DPSS (Other) |
Laser Wavelength: | Other / Non-Specified |
Laser Output Power: | -- W |
Laser Safety: | Class 1 |
Work Area X: | -- mm |
Work Area Y: | -- mm |
Processing Speed: | -- mm/sec |
Features And Options: | Integrated, Includes Safety Enclosure, Other (see Data Sheet) |
Features
- Ultra-Compact footprint
- Robust architecture
- Modular and flexible
Applications
- Laser marking
- Laser welding
- Laser engraving
- Laser cutting
- Laser drilling
- Laser structuring and texturing
- Laser thin film removal
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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Ships from:
Belgium
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
Yes, the LS3 BASIC is designed to enable micromachining applications with high quality.
The LS3 BASIC is suitable for laser marking, welding, engraving, cutting, drilling, structuring and texturing, as well as thin film removal.
The LS3 BASIC has an ultra-compact footprint, robust architecture, and is modular and flexible.
The LS3 BASIC is a laser instrument designed for micromachining applications in an industrial environment.
The LS3 BASIC can integrate our complete range of laser sources.