microCELL MCS High Throughput Laser System with TLS Technology
Description
system that provides free choice of cell cutting layouts. These
range from half to shingle cut cells without compromising
throughput or yield.
unmatched edge quality in solar cell cutting, the future-proof
microCELL™ MCS fits into an intelligent, scalable production line
with minimized efforts on upgrading by adding functionalities.
microCELL MCS High Throughput Laser System with TLS Technology
Specifications |
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|---|---|
| Materials: | Metals, Thermoset Plastics, Thermoplastics, Polimers, Textile, Wood, Paper, Stones, Ceramics, Glass |
| Laser Type: | Other / Not specified |
| Laser Wavelength: | 1070 nm (IR) |
| Laser Output Power: | W |
| Laser Safety: | Class 1 |
| Work Area X: | -- mm |
| Work Area Y: | -- mm |
| Processing Speed: | -- mm/sec |
| Features And Options: | Integrated, Includes Safety Enclosure, Multi-Axis |
Features
- Unsurpassed flexibility on the number of cell cuts
- > 6,000 wafers per hour throughput
- One-pass contactless dicing process
- Outstanding upgradeability
- Future proof by accommodating wafer sizes of up to M12/G12
- Dedicated automated handling solutions
- Low cost of ownership and CAPEX
Applications
For pricing, technical or any other questions please contact the supplier
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- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
Germany
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The microCELL MCS is suitable for use cases within the photovoltaic production, particularly for cutting solar cells with smooth and defect-free edges.
The benefits of using TLS technology include additional module power output, exceptional mechanical strength of cut cells, avoidance of microcracks, reduced module power degradation, ability to passivate cutting edge, and low cost of ownership.
The microCELL MCS offers unsurpassed flexibility on the number of cell cuts, over 6,000 wafer per hour throughput, one-pass contactless dicing process, outstanding upgradeability, future proof by accommodating wafer sizes of up to M12/G12, dedicated automated handling solutions, and low cost of ownership and CAPEX.
The microCELL MCS is an advanced cell cutting system that uses Thermal Laser Separation (TLS) technology for smooth and defect-free cutting edges in solar cell cutting.
The microCELL MCS is suitable for wafer sizes ranging from M2 to M12/G12 (up to 220 mm x 220 mm), wafer thickness of 0.12 to 0.25 mm, wafer material of silicon, and all common cell technologies such as PERC, TOPCon, HJT, IBC, and tandem cells.