MicroMake 532 Plus Laser Micromachining System 10kW
Description
The MicroMake Laser Micromachining System by Bright System is a cutting-edge solution engineered for precise and versatile microprocessing applications. With over 20 years of expertise in laser technology, this compact yet powerful system is designed to meet the demanding requirements of modern manufacturing and research environments.
At its core, the MicroMake system offers exceptional precision, allowing for the ablation and cutting of programmable arbitrary shapes with unmatched accuracy. Its live imaging feature enables real-time monitoring of the machining process, ensuring precise control and optimal results.
Versatility is a hallmark of the MicroMake system, which is capable of working with a wide range of materials, including metals, ceramics, transparent substrates, and polymers. This adaptability is further enhanced by its robust 532/266 nm ns and ps lasers, making it indispensable across industries such as microelectronics, biomedicine, optics, and micromechanics.
Featuring a standard processing area of 1 mm and a spot size as small as 2 µm, the MicroMake system delivers intricate details with utmost precision. Optional features like an XYZ translation stage and different objective lenses offer additional flexibility, catering to a variety of specific requirements.
With its user-friendly design, compact footprint, and low-voltage electrical power requirements, the MicroMake system is ideal for OEM integration and seamless operation in diverse environments. Backed by Bright System's commitment to quality and innovation, the MicroMake Laser Micromachining System sets new standards for precision engineering and microprocessing excellence.
MicroMake 532 Plus Laser Micromachining System 10kW
Specifications |
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|---|---|
| Materials: | Metals, Thermoset Plastics, Thermoplastics, Polimers, Ceramics, Glass |
| Laser Type: | DPSS (Nd:YAG) |
| Laser Wavelength: | 532 nm (green) |
| Laser Output Power: | -- W |
| Laser Safety: | Not classified |
| Work Area X: | 150 mm |
| Work Area Y: | 150 mm |
| Processing Speed: | 5 mm/sec |
| Features And Options: | Air-Cooled |
| Lens Magnification: | 10x |
| Working Distance: | 39 mm |
| Spatial Resolution: | 4.5 µm |
| Laser Frequency: | 1 kHz |
| Max Peak Power: | 10 kW |
Features
- Ablation and cutting of programmable arbitrary shapes
- Live imaging of the processed samples during machining
- Suitable for a wide range of materials
- 1 mm standard processing area
- Down to 2 µm spot size
- 532/266 nm ns and ps lasers
- Embedded illumination unit
- Optional XYZ translation stage
Applications
- 3D direct microstructuring
- Precision surface texturing
- Track interruption on PCBs
- Microcoding for anti-counterfeiting
- Thin film removal on hard substrates
- Selective metal removal on ceramic substrates
- Microcorrection on wafers, masks, and displays
- Microdrilling on metals and transparent dielectrics
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
United States
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Sold by:
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On FindLight:
since 2014
Frequently Asked Questions
The MicroMake Laser Micromachining System is an integrated and compact laser micromachining unit designed for high precision and resolution applications. It includes all the necessary components for direct laser microprocessing within a single monolithic element.
The MicroMake system offers features such as ablation and cutting of programmable arbitrary shapes, live imaging of processed samples during machining, suitability for a wide range of materials, a standard 1 mm processing area with a spot size down to 2 µm, and optional XYZ translation stage for enhanced flexibility.
The MicroMake system is suitable for a variety of applications including 3D direct microstructuring, precision surface texturing, track interruption on PCBs, microcoding for anti-counterfeiting, thin film removal on hard substrates, selective metal removal on ceramic substrates, microcorrection on wafers, masks, and displays, and microdrilling on metals and transparent dielectrics.
The MicroMake system offers various optional features including different objective lenses, a high speed/high resolution USB camera for detailed monitoring, circular polarization on the workpiece, an external control box, table-top version with external mounts and manual stages, XY manual or motorized stage, Z manual or motorized stage, and a class 1 safety enclosure with an interlocked door.
The specifications vary depending on the model chosen, including wavelength (532 nm or 266 nm), lens magnification, working distance, spatial resolution, maximum processing area, frequency, max peak power, typical processing linear speed, cooling method, weight, and dimensions. Refer to the product documentation for detailed specifications.
Yes, the MicroMake system is designed with a compact footprint and single low-voltage electrical power requirements, making it ideal for OEM integration. Additionally, the system can be customized with additional options to meet specific application requirements.