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Frequently Asked Questions

The microPRO Industrial Laser System can be used for loading and unloading handling according to customers’ specification, RFID or Data matrix reader (DMC), and automatic handling system for industrial applications on request.

The configuration packages for the microPRO Industrial Laser System may include high-speed cutting, drilling, engraving, structuring, and modification. It also has one laser source (ns/fiber/fs/ps/CO2) beam delivery unit, one beam path with different options, 2D- and 3D-galvo scanner models or fixed optics, and power measurement at workpiece level.

The microPRO Industrial Laser System features flexible, stable, and repeatable machining results, integration of different laser sources, various optical setups, quick changing of workpiece clamping unit, user-friendly, flexible, upgradeable system control, and a high range of software functions. It is also available with an automatic handling system for industrial applications on request.

The microPRO Industrial Laser System is mainly used in industrial production for laser structuring, cutting, and drilling applications on a variety of materials such as metals, alloys, transparent and biological substrates, ceramics, and thin-film compound systems.

The software used for the microPRO Industrial Laser System is microMMI™, which controls and supervises all hardware components and machining parameters. It has different user levels (administrator, supervisor, operator) and can accept data input file types such as DXF, CSV, Gerber, CLI, GDSII.

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