SR 25 AOM 9.3um CO2 Laser
Description
Due to its precise pulse control, the SR AOM series is ideal for a variety of high-precision processes such as microfilm cutting in the flat panel display market and scribing, engraving, marking and surface patterning applications that need less heat affected zone (HAZ). Other thin film applications, including those in the automotive, electronics, lighting and flexible packaging industries, can benefit from the higher quality cutting edge which the SR AOM offers when compared to standard pulsed CO2 lasers.
SR 25 AOM 9.3um CO2 Laser
Specifications |
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Gas Medium: | CO2 |
Wavelength: | 9.3 um |
Output Power: | 150 W |
Mode Quality (M^2): | <1.2 |
Beam Diameter: | 7.7 ± 0.5 mm |
Beam Divergence (Full Angle): | < 2 mrad |
Polarization: | Linear |
Cooling: | Water-to-Water |
Features
SR AOM series – 150W sealed CO2 laser source with integrated acousto-optic modulator (AOM)
- Optical pulse rise/fall time < 1μs for high-precision processing, energy control and reduced HAZ
- Integrated, detachable and field replaceable RF power supply for ease of installation and servicing
Applications
- Film cutting in FPD (flat panel display)
- Polarizing film cutting
- BLU (backlight unit) patterning
- Multilayer thin film scribing/cutting
- High-speed/resolution printing
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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Ships from:
United Kingdom
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Sold by:
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On FindLight:
since 2019
Frequently Asked Questions
Some of the applications of the SR 25 AOM 9.3um CO2 Laser include film cutting in FPD (flat panel display), polarizing film cutting, BLU (backlight unit) patterning, multilayer thin film scribing/cutting, and high-speed/resolution printing.
The maximum duty cycle of the AOM pulsing mode is 100%.
The maximum output power of the external control facilities is 7.5kW.
The recommended flow rate for cooling the AOM is greater than or equal to 3L/min.
The SR AOM series is ideal for high-precision processes such as microfilm cutting, scribing, engraving, marking, and surface patterning applications that need less heat affected zone (HAZ).