Maiman Laser 355nm 15W High Energy UV Laser Source MMEPU-355-15-HE for Wafer Scribing
Tianjin Maiman Laser Technology Co., Ltd
Description
The high-energy ultraviolet laser, characterized by a wavelength of 355nm, features a single-pulse energy of 1.5mJ and a high peak power.
It efficiently cuts SiC and diamond wafers, directly severing the wafers and metal layers with high efficiency and a minimal edge breakage (<2um).
For more details, clickMaiman Laser 355nm High Energy UV Laser
Maiman Laser 355nm 15W High Energy UV Laser Source MMEPU-355-15-HE for Wafer Scribing
Tianjin Maiman Laser Technology Co., Ltd
Specifications |
|
|---|---|
| Avg. Power: | 15 W |
| Wavelength: | 355 nm |
| Repetition Rate: | 10-20kHz |
| Spatial Mode (M^2): | ＜1.3 |
| Pulse Duration: | 30 ns |
| Pulse-to-Pulse Stability (RMS): | <±3% % |
| Cooling: | Water-to-Water |
Features
- The laser power is 15W;
- Adopt UV-clean patented technology to solve power attenuation worry free used;
- The service life exceeds 20000 hours, maintenance is free, and no need for regular commissioning or calibration;
- Excellent beam quality M² < 1.3, simple process, and higher efficiency;
- 3-layer protection, protection grade IP65, more suitable for harsh working environment;
- Rugged, easy to install, and easy to integrate.
Applications
- Sic, diamond wafer scribing
- Drilling and dicing of wafers
- Ceramic scribing and drilling
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
China
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Sold by:
Tianjin Maiman Laser Technology Co., Ltd -
On FindLight:
since 2023