Spruce Low-Power Nanosecond UV Laser Spruce-355-3
Description
Huaray-Spruce Low Power UV DPSS Lasers (3W/5W) is featured with compact structure design ensuring great performance and beam transmission. Especially, in mass production, still can keep very high stability and reliability, which can satisfy all kinds of industrial manufacturing even in harsh working condition. This laser is low maintenance and easy to integrate with other equipment, can save a lot of time, money and energy.
Spruce Low-Power Nanosecond UV Laser Spruce-355-3
Specifications |
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|---|---|
| Avg. Power: | 3 W |
| Wavelength: | 355 nm |
| Repetition Rate: | 20-200kHz |
| Spatial Mode (M^2): | 1.2 |
| Pulse Duration: | 20 ns |
| Pulse-to-Pulse Stability (RMS): | 3 % |
| Cooling: | Water-to-Water |
Features
- Stable output of power and pulse width
- Excellent beam quality, M²<1.2
- High beam pointing stability
- Wide repetition rate range:20-200kHz
- Controllable with RS232 interface
- Unique Intracavity frequency doubling technology.
- Triggerable external
Applications
They are widely used in 3C industry marking, white plastic and electrical enclosure tag marking. Processing on the fly in food, medical packing and various package material, removal of metal and non-metal coating, scribing for various materials, blind slot processing, as well as new ultra-thin metal foil and other microprocessing.
For pricing, technical or any other questions please contact the supplier
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- No markups, no fees
- Direct contact with supplier
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China
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Frequently Asked Questions
The output power of the Spruce Low-Power Nanosecond UV Laser is greater than 3W at 40kHz and greater than 5W at 40kHz for the Spruce-355-3 and Spruce-355-5 models, respectively.
The repetition rate range of the laser is 20-200kHz.
The laser has excellent beam quality with M²<1.2.
The polarization ratio of the laser is horizontal, greater than 100:1.
The laser is suitable for a wide range of applications, including 3C industry marking, white plastic and electrical enclosure tag marking, processing on the fly in food and medical packing, removal of metal and non-metal coating, scribing for various materials, blind slot processing, and new ultra-thin metal foil and other microprocessing.