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TMAP-AP Metrology Solution For 3D IC-TSV Process Control
Description
The TMAP-AP is the complete metrology solution for 3D IC/TSV process control with the best balance between performance, throughput and cost of ownership (CoO). The TMAP-AP measure multiple layer stacks and differentiate them in the order they are placed. Even under highly warped conditions, the TMAP Series’ state of the art design provides dependable measurement where and when you need it.
TMAP-AP Metrology Solution For 3D IC-TSV Process Control
Applications
Advanced Packaging
MEMS
FOWLP
2.5D & 3D IC TSV
HBM
For pricing, technical or any other questions please contact the supplier
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- Direct contact with supplier
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Ships from:
France
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The TMAP-AP metrology solution is used for 3D IC/TSV process control.
The main applications of the TMAP-AP include advanced packaging, MEMS, FOWLP, 2.5D & 3D IC, and TSV.
The TMAP-AP is able to differentiate multiple layer stacks based on the order they are placed.
Yes, the TMAP-AP's state-of-the-art design allows for dependable measurements even under highly warped conditions.
The TMAP-AP offers the best balance between performance, throughput, and cost of ownership (CoO) for 3D IC/TSV process control.
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