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TMAP NST3D Non-Contact Full Field Metrology Solution
Description
The TMAP NST is a non contact full field metrology solution based on optical microscopy enabling surface topography measurements at the nano scale. The TMAP NST is pushing the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM space.
TMAP NST3D Non-Contact Full Field Metrology Solution
Applications
Cu CMP
Hybrid Bonding : Pre/Post Bonding
Front End CMP
Front End Etch
On/Out of plane Overlay
For pricing, technical or any other questions please contact the supplier
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How to order?
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Ships from:
France
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The TMAP NST3D is a non-contact full field metrology solution based on optical microscopy that enables surface topography measurements at the nano scale.
The main applications of the TMAP NST3D include Cu CMP Hybrid Bonding, Pre/Post Bonding, Front End CMP, Front End Etch, and On/Out of plane Overlay.
The TMAP NST3D pushes the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM (Atomic Force Microscopy) space.
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced Synchronous Doppler Detection Technology to capture nanometer scale defects on all kinds of wafers.
The main applications of the LIGHTsEE include IQC Process Monitoring, Specialty Substrate, Advanced Packaging, Power, and MEMS.
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