SILICON CARBIDE POLISHER 6EZ
Description
SiC is a hard material to process. Revasum understands the challenges of working with SiC and has applied our knowledge of SiC grinding, prime silicon substrate polishing and CMP, to develop a unique solution that truly makes polishing SiC easy. The 6EZ can polish and clean both faces of 50 SiC substrates sequentially, without any operator intervention. Combining the 6EZ with Revasum’s fully-automated 7AF-HMG grinder, the entire process flow from wire slicing or laser splitting to EPI is synchronized to provide optimum performance and high yields at an affordable cost per wafer – delivering a production-ready solution for 150mm and 200mm SiC substrate manufacturing.
SILICON CARBIDE POLISHER 6EZ
Specifications |
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|---|---|
| Optics Dimension Range: | 1-1mm |
| Max Weight: | -- kg |
| Spindle Speed: | 1-1RPM |
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Frequently Asked Questions
The 6EZ polish module consists of three polish tables, three spindles, and an integrated post-polish cleaning module.
The 6EZ is a silicon carbide polisher developed by Revasum.
The entire process flow from wire slicing or laser splitting to EPI is synchronized to provide optimum performance and high yields at an affordable cost per wafer.
The high-pressure spray bar (pad cleaner) provides the best possible wafer-to-wafer process control.
The 6EZ is unique because it can polish and clean both faces of 50 SiC substrates sequentially, without any operator intervention.