TARGETSYSTEM
Description
TargetSystem is designed for target preparation of microelectronic components and delayering. It is the first failure analysis tool permitting real-time alignment and measurement of both visible and hidden targets, such as microvias and BGAs. System precision is an exceptional +/- 5.0 µm.
TARGETSYSTEM
Specifications |
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|---|---|
| Optics Dimension Range: | 200-200mm |
| Max Weight: | 10 kg |
| Spindle Speed: | 40-300RPM |
Features
Drastically reduced preparation time
No dependency on operator skills
Full reproducibility
No need for costly abrasive films
For pricing, technical or any other questions please contact the supplier
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Frequently Asked Questions
TargetSystem is designed for target preparation of microelectronic components and delayering.
The system precision is an exceptional +/- 5.0 µm.
The noise level during preparation is 54 dB (A).
The weight of the TargetGrip tiltable specimen holder is 0.58 kg / 1.27 lb.
The working environment temperature range for the TargetSystem is 5-40°C / 41-104°F.
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