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Raw Wafers

4'' 6'' 8'' Silicon Wafer
Henan UM Optics Ltd
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4'' 6'' 8'' Silicon Wafer
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Silicon wafer is an important material for making integrated circuits. Integrated circuits and various semiconductor devices can be made by photolithography, ion implantation and other methods on silicon wafers. It is a sheet-shaped object made of silicon and has the characteristics of high purity, high density and large scale.

Specifications
Wafer Material: Silicon (Si)
Diameter: - mm
Thickness: 280-1000 um
Size: 4'' 6'' 8''
Type: NP
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Silicon Wafers
Ferrotec (USA) Corp
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Silicon Wafers
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If you’re looking for more about Ferrotec’s silicon wafer products, you can find more detailed information on Ferrotec’s Silicon Wafer web site. On the site, you’ll find a comprehensive resource, along with technical information about the specific product lines. We produce silicon wafers (12 inches or less) for semiconductors in an ...

Specifications
Wafer Material: Silicon (Si)
Diameter: 101.6-304.8 mm
Thickness: -- um
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Germanium And Silicon Wafers
Novotech Inc
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Germanium And Silicon Wafers
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These custom wafers can have non-standard diameters or thickness, laser marking, flats, chemical etching, etc... Test or Mechanical grade Wafers We supply test/monitor wafers, or monitor wafers for testing semiconductor fabrication lines and processes. We put prime polished wafers through a sophisticated chemical-mechanical polishing ...

Specifications
Wafer Material: Silicon (Si), Germanium (Ge)
Diameter: 15-150 mm
Thickness: 0.3-5 um
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Gallium Antimonide Epitaxy Ready Polished Wafers
Wafer Technology Ltd
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Gallium Antimonide Epitaxy Ready Polished Wafers
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Gallium Antimonide is supplied in polished wafer form. All slices are individually laser scribed with ingot and slice identity to ensure perfect traceability. Surface orientations are offered to an accuracy of +/- 0.05 degrees using a triple axis X-Ray diffractometer system. Substrates can also be supplied with very precise ...

Specifications
Wafer Material: Gallium Antimonide (GaSb)
Diameter: 50.5-100 mm
Thickness: 500-1000 um
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Gallium Arsenide Epitaxy Ready Polished Wafers
Wafer Technology Ltd
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Gallium Arsenide Epitaxy Ready Polished Wafers
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Gallium Arsenide can be supplied in as-cut, etched or polished wafer forms. All slices are individually laser scribed with ingot and slice identity to ensure perfect traceability. Surface orientations are offered to an accuracy of +/- 0.05 degrees using a triple axis X-Ray diffractometer system. Substrates can also be supplied with ...

Specifications
Wafer Material: Gallium Arsenide (GaAs)
Diameter: 50.5-76.2 mm
Thickness: 350-625 um
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Indium Phosphide Epitaxy Ready Polished Wafers
Wafer Technology Ltd
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Indium Phosphide Epitaxy Ready Polished Wafers
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Indium Phosphide can be supplied in as-cut, etched or polished wafer forms. All slices are individually laser scribed with ingot and slice identity to ensure perfect traceability. Surface orientations are offered to an accuracy of +/- 0.05 degrees using a triple axis X-Ray diffractometer system. Substrates can also be supplied with ...

Specifications
Wafer Material: Indium Phosphide (InP)
Diameter: 50.5 mm
Thickness: 350-500 um
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There are 6 different Raw Wafers from suppliers and manufacturers listed in this category. In just a few clicks you can compare different Raw Wafers with each other and get an accurate quote based on your needs and specifications. Please note that the prices of Raw Wafers vary significantly for different products based on various factors including technical parameters, features, brand name, etc. Please contact suppliers directly to inquire about the details and accurate pricing information for any product model. Simply navigate to the product page of interest and use the orange button to directly reach out to the respective supplier with one click.