Laser Drilling
Description
Laser hole drilling of vias, micro holes, pinholes, nozzles, orifices, and slots meet a variety of applications such as instrumentation, print heads, bio-sensors, high-density interconnects, filters, medical devices, and aerospace components. Dimensional and positional tolerances of 5um or better are achieved.
MLT laser drilling processes utilize various wavelengths including ultraviolet (UV), infra-red (IR), or hybrid (both UV and IR) depending on the hole diameter and material selection. Hole quality is subjective to the criteria of the design’s form, fit, and function. Process time or cost may also determine the level of quality required.
Laser produced hole quality is assessed in terms of roundness, taper, entrance and exit diameter tolerances, oxidation (i.e. metals), burring or recast layer, and micro-cracking (i.e. glass). Aspect ratios and material selection are elements that contribute to straight wall or tapered hole profiles. Laser drilling can be used to produce 10um and larger diameter holes in most any material including metals, ceramics, plastics, silicon, rubbers, and glass. MLT laser drilling processes match the optimal wavelength and beam profile for the absorption property of the specified material. These processes are derived from two core laser drilling methodologies, percussion and trepanning.
Laser Drilling
Specifications |
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| Type Of Service: | Engineering design |
Features
- Alignment and Scale Methodologies for Minimal Annular Ring Requirements
- Large Via Process Technology that Inhibits Target Pad Delamination
- Lot/Panel Scale Reporting and Analysis for Drill Optimization
- Via Trax ™ Technology for Target Pad Surface Texturing
- Processes for IPC High Density Interconnect Types
- Advanced uVia Diameters Less than 25um
- 100% uVia Vision Inspection (In Development)
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
United States
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Sold by:
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On FindLight:
since 2020
Frequently Asked Questions
The dimensional and positional tolerances achieved through laser drilling are 5um or better.
The factors that contribute to hole quality in laser drilling are roundness, taper, entrance and exit diameter tolerances, oxidation (i.e. metals), burring or recast layer, and micro-cracking (i.e. glass).
Laser drilling is used for creating holes in materials such as metals, ceramics, plastics, silicon, rubbers, and glass for various applications such as instrumentation, print heads, bio-sensors, high-density interconnects, filters, medical devices, and aerospace components.
MLT offers microvia drilling, laser routing, laser skiving, laser marking, and PCB laser rework services for PCB laser processing.
MLT laser drilling processes utilize various wavelengths including ultraviolet (UV), infra-red (IR), or hybrid (both UV and IR) depending on the hole diameter and material selection.