Laser Skiving
Description
Laser skiving is a selective ablation process that can remove one material with or without affecting an underlying material. In the simplest terms, laser skiving is the use of energy over time. Where some skiving tools use random energy delivery within a desired area, Micron Laser Technology can effectively ‘etch’ a material in a controlled order of energy delivery across the material surface. This creates a uniformed visual effect and significantly less variation in surface topography when depth control is desired.
Laser skiving is a function of material and wavelength for absorption. Skiving methods can be classified as material boundary or control depth dependent. Skiving depth can be controlled by the physical boundary of a dissimilar material’s absorption rate (i.e. polymer to metal). Control depth skiving allows for a stopping depth in the same material by removing one thin layer of material at a time without cutting through the material. Our superior laser energy control can stop in less than .001″ thick of adhesive.
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United States
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On FindLight:
since 2020
Frequently Asked Questions
Laser skiving uses energy over time to etch a material in a controlled order of energy delivery across the material surface, creating a uniformed visual effect and significantly less variation in surface topography when depth control is desired.
Laser skiving can be used for cavity formation, floating contacts (fingers), squeeze-out removal, dry film or polyimide removal, circuit formation and isolation, buried wirebond pads, and selective soldermask removal.
The positional and dimensional tolerances of laser service are +/- .002" (50um) for infrared (CO2) and +/- .001" (25um) for ultraviolet (UV).
Control depth skiving allows for a stopping depth in the same material by removing one thin layer of material at a time without cutting through the material.
Laser skiving is a selective ablation process that can remove one material with or without affecting an underlying material.