Silicon And Germanium Basic Machining
Description
Even when specifying silicon and germanium parts that only require basic machining steps like coring, grinding and slicing, your vendor is of critical importance. Since these materials are extremely hard and brittle, improper machining and handling techniques can create subsurface damage that weakens the part and hinders performance. Lattice Materials has developed specific handing and machining techniques in our over 25 years of being in business. We can deliver virtually chip-free parts in either round or rectangular configurations. Our high-precision saws, grinders and metrology ensures the best possible yield and performance in your parts. For as-cut parts, we commonly apply a protective bevel to ensure that chips don’t form throughout any additional machining steps.
Silicon And Germanium Basic Machining
Specifications |
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| Type Of Service: | Engineering design, Industrial design, Manufacturing design |
For pricing, technical or any other questions please contact the supplier
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United States
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Frequently Asked Questions
Our laser instruments are designed to machine hard and brittle materials such as silicon, germanium, BK7, YAG, and more.
Lattice Materials has been in business for over 25 years.
We can deliver virtually chip-free parts in either round or rectangular configurations.
Yes, for as-cut parts, we commonly apply a protective bevel to ensure that chips don't form throughout any additional machining steps.
Our laser instruments can handle diameters up to 18.5" and thicknesses up to 14.5".