Thin-Film Circuit Manufacturing Services
Description
Our company partners with component designers like you to envision, prototype, and produce innovative thin-film micro circuits and components. Having served a wide variety of demanding medical, RF/microwave, aerospace, defense, telecommunications, commercial printing, and photonics clients over the last 30 years we’ve honed our micro circuit design and manufacturing skills and offer a wide choice of materials on which we can produce your micro circuit ideas on. We can deliver down to sub-micron levels with industry-leading circuit densities and with impressive yields. Six or more layers are achievable, including conductive layers that are independently stacked, aligned and interconnected.
Thin-Film Circuit Manufacturing Services
Specifications |
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| Type Of Service: | Concept development, Project management, Engineering design, Manufacturing design |
Features
High density lines and spaces as small as 5 microns
Vias as small as 25 microns in diameter
Substrates laser cut and drilled to any geometry
Plated through holes and vias with "metal backed" ceramics
Multi-layer circuits with up to six metal layers
Solder masks (metal or polyimide)
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
United States
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
They serve a wide variety of industries such as medical, RF/microwave, aerospace, defense, telecommunications, commercial printing, and photonics.
Six or more layers are achievable, including conductive layers that are independently stacked, aligned and interconnected.
The minimum size of vias is 25 microns in diameter.
The Thin-Film Circuit Manufacturing Service is a service that partners with component designers to envision, prototype, and produce innovative thin-film micro circuits and components.
The unique approach to micro circuit production is an additive manufacturing approach that ensures the vertical walls of your medical and RF micro circuits and sensor components are the same width at the top as at the bottom, so your circuit-to-circuit and lot-to-lot reliability is maintained.