Fully Automatic Laser Solder Ball Spray Welding System HW-LS-JETTING
Description
The system integrates automatic feeding module, CCD positioning before welding, high-speed solder ball jet welding module, post welding AOI detection, automatic blanking module, etc. Combined with general or customized clamping tools, it can realize solder ball jet welding and AOI post welding detection of different types of products.
The solder ball welding speed of the system can reach 5 balls per second, which has the advantages of high speed, stable amount of tin, non-contact welding and no flux.
The self-developed fiber laser cooperates with the automatic nozzle alignment system to implement the full-automatic focus finding and position alignment of the high-speed solder ball system. It saves the nozzle replacement time and improves the nozzle service life and spray position accuracy.
The system is widely used in solder ball spray welding of precision parts in 3C electronic industry.
Fully Automatic Laser Solder Ball Spray Welding System HW-LS-JETTING
Specifications |
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|---|---|
| Platform Type: | Automatic |
| Materials: | Stainless Steel, Iron, Galvanized Steel, Aluminum, Brass, Copper, Gold, Silver, Nickel, Titanium, Platinum, Plastic |
| Welding Process: | Direct Laser Welding, Transmission Welding, Keyhole Welding, Precision Welding, Seam Welding, Sheet Welding, Pipe Welding, Spot Welding |
| Laser Type: | Fiber Laser |
| Laser Output Power: | 75-150 W |
| Laser Wavelength: | -- nm |
| Laser Operation Mode: | Continuous Wave (CW) |
| Laser Cooling Mode: | Unspecified |
Features
- With CCD positioning and post welding AOI detection, it can automatically identify the product position and welding quality.
- The solder ball has fast spray rate and high welding efficiency.
- With automatic laser energy detection and nozzle finding function, convenient to replace the consumables.
- Fully automatic loading and unloading, high degree of automation.
- Wide range of applications, compatible with spray welding of 0.25mm-0.889mm solder balls of various sizes.
Applications
- Solder ball welding of precision structural parts in 3C electrical industry
- TATCH
- PAD
- CCM module
- semiconductor wafer and other industries
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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Frequently Asked Questions
The main features of the system include CCD positioning, post welding AOI detection, fast spray rate of solder balls, automatic laser energy detection, and fully automatic loading and unloading.
The solder ball welding speed of the system can reach 5 balls per second.
This system is widely used in solder ball spray welding of precision parts in the 3C electronic industry, as well as in the solder ball welding of precision structural parts in the 3C electrical industry, TATCHPAD, CCM modules, semiconductor wafers, and other industries.
No, the system uses a self-developed fiber laser and an automatic nozzle alignment system to implement full-automatic focus finding and position alignment, eliminating the need for manual nozzle alignment.
The system is compatible with spray welding of solder balls ranging from 0.25mm to 0.889mm in size.