Olive Low-Power Picosecond Ultrafast Laser Olive-1064-10
Description
The Huaray-Olive series, Low-power Picosecond Ultra-fast Lasers (4W@532nm, 10W@1064nm), Robust and affordable, it produces high energy pulses with durations below 10 ps. The laser is based on a hybrid optical amplifier architecture that combines the advantages of fiber laser technology with solid state diode pumped multi-pass amplifiers. Compact and water-cooled, this laser is low maintenance and never needs realignment. special specification can be customized, this laser is ideal for fast, high precision material processing at an affordable price.
Olive Low-Power Picosecond Ultrafast Laser Olive-1064-10
Specifications |
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|---|---|
| Center Wavelength: | 1064 nm |
| Repetition Rate: | 50-1000kHz |
| Pulse Energy: | 0.02 mJ |
| Energy Stability (RMS): | 3 % |
| Pulse Duration: | 10000 fs |
| Pointing Stability (RMS): | 50 urad |
| Polarization: | Horizontal |
| Spatial Mode (M^2): | <1.2 |
| Amplification Scheme: | Multi-Pass |
Features
- <10 picosecond pulses
- Long term power stability <3%rms
- High beam quality with M2≤1.3
- Serial Interface
Applications
They are widely used in Micro-machining, Ceramic Processing, Glass Cutting, Medical Plastic Processing, Sapphire Processing, Steel Processing, Laser Deposition, Thin Film Patterning, Hard Materials Machining and so on.
For pricing, technical or any other questions please contact the supplier
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Ships from:
China
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Frequently Asked Questions
The output power of the Olive Low-Power Picosecond Ultrafast Laser is 4W@532nm and 10W@1064nm.
The pulse width of the Olive Low-Power Picosecond Ultrafast Laser is less than 10 picoseconds.
The Olive Low-Power Picosecond Ultrafast Laser has high beam quality with M2≤1.3.
The polarization ratio of the Olive Low-Power Picosecond Ultrafast Laser is vertical, >100:1 and horizontal, >100:1.
The Olive Low-Power Picosecond Ultrafast Laser is widely used in Micro-machining, Ceramic Processing, Glass Cutting, Medical Plastic Processing, Sapphire Processing, Steel Processing, Laser Deposition, Thin Film Patterning, Hard Materials Machining and so on.