Wafer Technology Ltd
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Frequently Asked Questions

Polished wafers are packaged in a coin-style wafer shipper, individually sealed in two outer bags in an inert atmosphere. Cassette shipments are available on request.

Surface orientations are offered to an accuracy of +/- 0.05 degrees using a triple axis X-Ray diffractometer system. Higher index substrates of the type (n,1,1) where n = 1,2,3,4,5,6 etc and orientations such as (110) are also available.

The electrical and dopant specifications of the wafer include dopant type, carrier concentration cm-3, mobility cm2 V-1 s-1, and E.P. D. cm-2.

Gallium Antimonide is a material supplied in polished wafer form.

The thickness of the wafer is 500 ± 25 µm for 2", 625 ± 25 µm for 3", and 1000± 25 µm for 4".

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