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Frequently Asked Questions

The FilmTek 2000 PAR is used for high-throughput, fully-automated mapping of patterned wafers for development and production environments.

The spot size of the FilmTek 2000 PAR can be as small as 13µm.

The FilmTek 2000 PAR has simultaneous determination of multiple layer thicknesses, indices of refraction, extinction coefficients, energy band gap, composition, surface roughness, constituent void fraction, crystallinity/amorphization, and film gradient.

The FilmTek 2000 PAR comes with advanced material modeling software to make even the most rigorous of measurement tasks reliable and intuitive.

The FilmTek 2000 PAR utilizes patented DUV-NIR reflectometry with wafer auto-loader and pattern recognition.

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