FilmTek 2000 PAR-SE
Description
The FilmTek™ 2000 PAR-SE combined metrology line is our most advanced benchtop metrology solution, with the highest accuracy, precision, and versatility in the industry. The FilmTek™ 2000 PAR-SE was engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. The FilmTek™ 2000 PAR-SE combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the most challenging of measurement demands. SCI’s patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films. Combining patented Multi-Angle Differential Polarimetry (MADP) and Differential Power Spectral Density (DPSD) technology, the FilmTek™ 2000 PAR-SE utilizes multi-angle polarized spectroscopic reflectometry to independently measure film thickness and index of refraction. By independently measuring index and thickness, the FilmTek™ 2000 PAR-SE is far more sensitive to changes in films, particularly films within multi-layer stacks, than existing metrology tools that rely on conventional ellipsometry or reflectometry techniques. The FilmTek™ 2000 PAR-SE is a fully-integrated package, paired with advanced material modeling software to make even the most rigorous of measurement tasks reliable and intuitive. Both hardware and software can be easily modified to satisfy unique customer requirements.
FilmTek 2000 PAR-SE
Specifications |
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|---|---|
| Wavelength Range (reflectance): | 190-1700nm |
| Resolution: | 0.3-2 nm |
| Minimum Scan Time: | 1 sec |
Features
Spectroscopic ellipsometry with rotating compensator design (295nm-1700nm)
Multi-angle, polarized spectroscopic reflection (190nm-1700nm)
Measures film thickness and index of refraction independently
Multi-Angle Differential Polarimetry (MADP) technology with SCI’s patented Differential Power Spectral Density (DPSD) technology
Ideal for measuring ultra-thin films (0.03 Å repeatability on native oxide)
Camera for imaging measurement location
Pattern recognition
50 micron spot size
Optional generalized ellipsometry (4×4 matrix generalization method) for anisotropy measurements (nx, ny, nz)
For pricing, technical or any other questions please contact the supplier
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Frequently Asked Questions
Yes, both the hardware and software of the FilmTek 2000 PAR-SE can be easily modified to satisfy unique customer requirements.
The FilmTek 2000 PAR-SE is a combined metrology line that is a benchtop solution for advanced thin film measurement applications.
The FilmTek 2000 PAR-SE has a wide spectral range of 190nm-1700nm, which allows it to meet the most challenging of measurement demands.
The FilmTek 2000 PAR-SE has a small spot size down to 50µm, which is ideal for direct measurement of product wafers and patterned films.
The FilmTek 2000 PAR-SE uses Multi-Angle Differential Polarimetry (MADP) and Differential Power Spectral Density (DPSD) technology to independently measure film thickness and index of refraction.