DIVIDOS HIGH SPEED LASER DEPANELING SOLUTION
Description
The DIVIDOS series meets all requirements for laser depaneling of rigid and flexible printed circuit boards and separates different materials extremely fast, stress-free and without residues. In the FULL CUT process (cut without webs), up to 300% more panels can be provided on a PCB and separated in this way, depending on the PCB design.
Optionally, using a second galvanometer can up to double the throughput capability of the DIVIDOS. The laser which operates without physical contact and is subject to almost no wear, resulting in extremely low operating costs.
DIVIDOS HIGH SPEED LASER DEPANELING SOLUTION
Specifications |
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|---|---|
| Work Area / Panel Length: | 457 mm |
| Work Area / Panel Width: | 457 mm |
| Work Area / Panel Thickness (Max): | -- mm |
| Scan Field: | Not specified |
| Scan Speed: | -- mm/sec |
| Laser Output Power: | -- W |
| Laser Wavelength: | -- nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | 25 um |
| Panel Material: | Rigid PCB, Double-Sided PCB |
Features
- With FULL CUT process (cut without webs), higher density of panels per printed circuit board
- Free cut for complex contours (e.g. circle shapes)
- Dedicated solution for PCB depaneling
- High edge quality and less residuals
- No carbonization
- Industry 4.0 ready
- Automatic camera calibration
- Automated routines for reference runs
- Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation
Applications
- Laser Depaneling
- Laser Ablation
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Germany
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Sold by:
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On FindLight:
External Vendor
Claim InnoLas Solutions GmbH Page to edit and add data
Frequently Asked Questions
The DIVIDOS HIGH SPEED LASER DEPANELING SOLUTION is used for laser depaneling of rigid and flexible printed circuit boards.
The FULL CUT process is a cutting method without webs, which allows for a higher density of panels per printed circuit board.
Yes, the DIVIDOS can perform free cuts for complex contours, such as circle shapes.
Yes, the DIVIDOS ensures high edge quality and leaves behind less residuals.
Yes, the DIVIDOS is industry 4.0 ready and comes with features like automatic camera calibration and automated vision system for precision alignment and scaling.