FPC Laser Depaneling Machine
Description
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts.
Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods. Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods.
Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.
FPC Laser Depaneling Machine
Specifications |
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|---|---|
| Work Area / Panel Length: | 600 mm |
| Work Area / Panel Width: | 450 mm |
| Work Area / Panel Thickness (Max): | 1.2 mm |
| Scan Field: | Not specified |
| Scan Speed: | -- mm/sec |
| Laser Output Power: | 10 W |
| Laser Wavelength: | 355 nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | 20 um |
| Panel Material: | FPCB |
Features
- No mechanical stress on substrates or circuits
- No tooling cost or consumables.
- Versatility: ability to change applications by simply changing settings
- Fiducial Recognition: more precise and clean cut
- Optical Recognition before PCB depaneling/singulation process begins. CMS Laser is one of the few companies to provide this feature.
- Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc.)
- Extraordinary cut quality holding tolerances as small as < 50 microns.
- No design limitation: ability to cut virtually and size PCB board including complex contours and multidimensional boards
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
China
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Sold by:
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On FindLight:
External Vendor
Claim Shenzhen SMTfly Electronic Equipment Manufactory Ltd Page to edit and add data
Frequently Asked Questions
The advantages of using a laser depaneling machine include no mechanical stress on substrates or circuits, no tooling cost or consumables, versatility in changing applications by simply changing settings, precise and clean cuts with fiducial recognition, and the ability to depanel virtually any substrate.
Yes, lasers provide a highly precise way of singulation without any risk of harming delicate circuits, regardless of the substrate.
A laser depaneling machine can cut virtually any substrate, including Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, and copper.
Laser depaneling machines offer extraordinary cut quality, holding tolerances as small as < 50 microns.
No, a laser depaneling machine has no design limitation and can cut virtually any size PCB board, including complex contours and multidimensional boards.