LPKF CuttingMaster 2000 Ci
Description
This UV laser system is ideal for cutting flexible, rigid-flexible and rigid printed circuit boards. Users benefit from the advantages of laser technology: the cuts are precisely positioned, there is a high degree of design freedom, and the surrounding material remains free of mechanical stress.
The systems of the LPKF CuttingMaster series are easy to operate thanks to the sophisticated, integrated software. In addition, the compact machines offer a convincing price comparable to that of mechanical cutting systems - without compromising quality, efficiency or flexibility.
LPKF CuttingMaster 2000 Ci
Specifications |
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Work Area / Panel Length: | 350 mm |
Work Area / Panel Width: | 250 mm |
Work Area / Panel Thickness (Max): | -- mm |
Scan Field: | Not specified |
Scan Speed: | -- mm/sec |
Laser Output Power: | 40 W |
Laser Wavelength: | 532 nm |
Axis Speed (X): | -- mm/sec |
Axis Speed (Y): | -- mm/sec |
Axis Speed (Z): | -- mm/sec |
Accuracy: | 25 um |
Panel Material: | Rigid PCB, Double-Sided PCB |
Applications
- Outstanding performance
- Optimal cost efficiency
- Integrated Tensor Technology
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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Ships from:
Germany
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The LPKF CuttingMaster 2000 Ci is used for cutting flexible, rigid-flexible, and rigid printed circuit boards.
Laser technology offers precise cuts, design freedom, and avoids mechanical stress on the surrounding material.
Yes, the LPKF CuttingMaster 2000 Ci is easy to operate thanks to its integrated software.
The LPKF CuttingMaster 2000 Ci offers a comparable price to mechanical cutting systems without compromising quality, efficiency, or flexibility.
The optional features for the LPKF CuttingMaster 2000 Ci include universal fixture solutions, MES connection, optimized extraction, and Uninterrupted Power Supply (UPS).