MicroCut 1000 Offline LASER Depaneling
Description
MicroCut 1000 Offline LASER is an automatic laser depaneling system for printed circuit boards. It offers clean and stress-free detachment of individual boards from an array of boards on a large panel.
MicroCut 1000 Offline LASER Depaneling
Specifications |
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Work Area / Panel Length: | 350 mm |
Work Area / Panel Width: | 350 mm |
Work Area / Panel Thickness (Max): | -- mm |
Scan Field: | Other (see specs) |
Scan Speed: | 200 mm/sec |
Laser Output Power: | 50 W |
Laser Wavelength: | -- nm |
Axis Speed (X): | 200 mm/sec |
Axis Speed (Y): | 200 mm/sec |
Axis Speed (Z): | 200 mm/sec |
Accuracy: | -- um |
Panel Material: | FR4, FPCB, Ceramics, SIP, PTFE, Metal, Rigid PCB, Double-Sided PCB |
Features
- Zero-Stress Depanelization Solution
- 15W UV LASER Source
- Automatic Alignment Compensation by CCD camera
- Milling Cutter intelligent mode
- Whole process monitoring on the operation error
- MES Ready
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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Ships from:
Singapore
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The MicroCut 1000 Offline LASER is an automatic laser depaneling system for printed circuit boards.
The features of the MicroCut 1000 Offline LASER include zero-stress depanelization solution, 15W UV LASER source, automatic alignment compensation by CCD camera, milling cutter intelligent mode, and whole process monitoring on the operation error. It is also MES ready.
The cutting speed of the MicroCut 1000 Offline LASER is adjustable from 0 to 200mm/s.
The power consumption of the MicroCut 1000 Offline LASER is 2500W.
The dimensions of the MicroCut 1000 Offline LASER are 1050W x 1550D x 1810Hmm and it weighs 1600kg.