PCB Laser Depaneling System
Description
With the advent of new and high power plus lower cost UV lasers there is greater adoption of cutting of materials like printed circuit boards. This boards may be produced from fiber glass materials like FR4 or for thin flexible circuits they may be fabricated from polyimide or kapton.
This process can now be handled easier and at higher throughput with lasers. Previous issues like jutting metal tracks can be minimized and there is minimal charring or heat affected zone. This provides a new method to the industry and is especially useful for low volume, high mix production and also for prototyping or engineering production as there is no need to invest in making mechanical die sets.
As the laser is far more stable and durable then mechanical punch or cutter it is easier to ensure long term good product cut quality. Moreover, the laser can be programmed easily to cut infinite patterns so there is no mechanical die making cost and lead time is almost instantaneous.
With thicker materials like FR4 high power UV laser can cut thicker boards with minimal charring and HAZ. As laser cutting does not induce mechanical stress or disturbance compare to mechanical cutting, drilling, routing and other contact type methods, path can be cut nearer to active areas besides reducing board thickness thus shrinking PCBs.
Other advantages include no constrain on board complex shapes, less likely manufacturing defects, easier fixturing and lending the process to automation. With our laser integration expertise and material handling experience we can design the tool customised to fit your exact need. Please contact us today to discuss your requirement.
PCB Laser Depaneling System
Specifications |
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|---|---|
| Work Area / Panel Length: | -- mm |
| Work Area / Panel Width: | -- mm |
| Work Area / Panel Thickness (Max): | -- mm |
| Scan Field: | Not specified |
| Scan Speed: | -- mm/sec |
| Laser Output Power: | -- W |
| Laser Wavelength: | -- nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | -- um |
| Panel Material: | FR4, FPCB, Ceramics, Rigid PCB, Double-Sided PCB |
Features
- Pre-camera vision product position registration and model check
- Coherent Avia NX UV laser with HurrySCAN head
- High capacity BOFA dust collector
- User friendly Window based software
- PCB flexible product jig adjustable for different board size
- High resolution and accurate Z stage with auto-focus function
- Large area low friction front loading platform for sliding multiple product jigs
- Fully covered class 1 safety enclosure
- Able to do cutting and marking together
- Compact size
Applications
- Auto vision positioning
- Cost saving – no consumables and die wear
- Able to cut odd, complex and micro shape section out of PCBs
- No mechanical stress on product
- Quick model change turnaround time
- Excellent cut finish
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Singapore
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Sold by:
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On FindLight:
External Vendor
Claim Hylax Technology Pte Ltd Page to edit and add data
Frequently Asked Questions
The system can cut materials like printed circuit boards made from fiber glass (FR4) or thin flexible circuits made from polyimide or kapton.
Laser cutting minimizes issues like jutting metal tracks, reduces charring or heat affected zones, allows for cutting near active areas, reduces board thickness, and eliminates the need for mechanical die sets.
Yes, the laser can be easily programmed to cut infinite patterns, eliminating the need for mechanical die making and reducing lead time.
No, laser cutting does not induce mechanical stress or disturbance compared to mechanical cutting methods, ensuring a high-quality cut finish.
Yes, the system is especially useful for low volume, high mix production, as well as prototyping or engineering production, due to its ability to handle different materials and cut complex shapes.